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COM-HPC Server Size (D/E) Carrier Board with PCIe/104, Slim-SAS Expansions Extreme Temperature -40°C to 85°C

  • COM-HPC Server (D/E) Support Ampere Altra/Intel Ice-Lake HCC
  • Intel Ice Lake Xeon D-2796TE, D-2775TE, D-2752TER
  • PCIe/104 Express Expansion Slot for Rugged StackPC
  • Multi-Expansion Slots :
    • 4x Slim-SAS(Vertical/Horizontal)
    • 1x mPCIe(Full Size)
    • 2x M.2 2280 M-Key(PCIe Gen4 x 4)
  • I/O : 2x GbE, 4x 10GbE, 1x VGA, 2x SATAIII, 2x COM(RS232), 4x USB3.0, 2x USB2.0
  • 12V DC Input
  • Dimension : 350 mm x 210 mm
  • Extreme Temperature -40°C to 85°C

 SK518 Datasheet




SK518 is based on COM-HPC Carrier Server Size E Form Factor, offers variety of on-board expansion slots, with 4x Slim-SAS (Vertical and Horizontal), 1x mPCIe(Full Size), 2x M.2 2280 M-Key.  The board also supports up to 6RDIMMs and onboard NVME/M.2/SATA interface. SK518 is driven by Ampere Altra Processor, features with up to 80 Arm-based cores which allows for more data to be processed with only 175W TDP to satisfy the demand of the greater performance and meanwhile lower the consumption of energy.

Efficient Product Design

In order to design all kinds of products in the shortest time, the COM-HPC provide a better way to improvement the process. SK518 does not only provide the COM-HPC carrier board, but also PCI/e 104 express expansion, slim-SAS, and M.2 and mini PCIe slot, will make the preliminary verification work more efficient.

The solutions include:
Multi-Expansion Slots
– PCIe/104 Express Expansion Slot
– 4x Slim-SAS(Vertical/Horizontal)
– 1x mPCIe(Full Size)
– 2x M.2 2280 M-Key(PCIe Gen4 x 4)


Ready for a Harsh Environment

7StarLake COM-HPC has the capability to operate in harsh environment. It accepts the extend range of temperature from -40°C to 85°C. With outstanding computing capability and efficient thermal design, SK518 is very suitable for industrial, military/aerospace and transportation.

Block Diagram


CPU Ampere Altra : Up to 80 Arm-based cores at 175W TDP

Intel ICE-Lake HCC : Up to 20 cores at 118W TDP

GPU Module Options NVIDIA® RTX A4500, 115W, 16GB GDDR6, 5,888 CUDA Cores

NVIDIA® RTX A2000, 60W, 8GB GDDR6, 2,560 CUDA Cores

Intel® Arc™ A370M, 30-50W, 4GB GDDR6, 8Xe Cores

Intel® Arc™ A730M, 80-120W, 12GB GDDR6, 24Xe Cores

Memory type DDR4 R-DIMMs up to 768GB
Chipset On CPU Module
Storage SlimSAS/M.2/SATA interface
Watchdog On CPU module :

1-255 sec. or 1-255 min.

software programmable and can be generate system reset.

Expansion Slot

PCIe/104 (Type2) 1x (2*PCIe x4、4*PCIe x1、2*SATA)
SlimSAS (Vertical) 2x (PCIe x8)
SlimSAS (Horizontal) 2x (PCIe x8)
MiniPCIe (Full Size) 1x (PCIe x1)
M.2 2x (M.2 2280 M-Key) (PCIe Gen4 x4)


Chipset On CPU Module / AST2510
VGA 1x


Chipset 1x Intel® I210iT

1x C827

IPMI AST2500 by request

External I/O

VGA 1x
USB3.0 4x
10GbE 4x
GbE 2x

Internal I/O

USB2.0 2x (Header)
DIDO 1x (4in/4out)
SATA Power 2x
Serial 2x (RS232)
LPC 1x
System Fan 1x
CPU Fan 1x
Front Panel Control 1x
Power Connector 1x (2x 4-pin terminal block)

Mechanical and Environmental

Form Factor COM-HPC Carrier Server Size D/E
Power Type 12V DC-IN
Dimension 350 mm x 210 mm
Operating Temperature -40°C to 85°C
Storage Temperature -40°C to 85°C
Relative humidity 10% to 90%, non-condensing

Standard Compliance

Standard Compliance CE/FCC


OS On CPU Module

Ordering Information