TEC300
Rugged Edge MXM Computer by Ampere® Q32, Nvidia Quadro A500
- Ampere® Altra® Q32-17 SoC, 32 cores, 1.7 GHz, Option Ampere Altra Q64 and Ampere Altra Max M128
- RAM DDR4-3200 MT/s Up to 4TB
- RTX MXM A500 GPU (2048 CUDA)
- 2x10G(SFP), 2x1G, 3xUSB3.0, 1xVGA, 5xCOM
- DC-IN 18V~36V
Special Request:
- 2 x CAN Bus
- AC Power In (Option)
CONTACT US FOR A QUOTE
Specifications
System | |
---|---|
CPU | Ampere® Altra® Q32 17 SoC 32 cores, 1.7 GHz, 45 W TDP, Option Ampere® Altra® Q64 and Ampere® Altra® Max M128 |
Memory type | 16x DIMM sockets with individual memory channels Up to 4TB (16 x 256 GB) DDR4 RDIMM memory, up to 3200 MT/s |
GPU |
|
Graphics Card | RTX MXM A 500 (2048 CUDA Cores) |
Storage | |
SSD | TBD |
Ethernet | |
Ethernet | 2x 1 Gigabit Ethernet with RJ45 2 x 10G SFP+ |
Side I/O | |
GLAN | 2 |
10 GbE SFP+ | 2 |
COM | 5 |
USB3.0 | 3 |
VGA | 1 |
DC-IN | 1 |
Power Requirement | 1 x Power Button with LED backlight |
OS support list | |
OS | Linux RedHat ,Ubuntu |
Power Requirement | 28V DC IN (18V 36V) |
Dimension | TBD |
Weight | 10 KG |
Operating Temp. | 0 C to 60°C |
Storage Temp. | -40°C to 85°C |
Relative Humidity | 5% to 95%, non condensing |
Environmental | |
MIL-STD-810 Test | Method 500.5, Procedures I and II (Altitude, Operation): 12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia) Method 500.5, Procedures III and IV (Altitude, Non-Operation): 15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) Method 507.5, Procedure II (Temperature & Humidity) Method 509.7 Salt Spray (50±5)g/L Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration) Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration) Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6, Shock-Procedure I Operating (Mechanical Shock) |
Reliability | Conduction Cooling. Designed & Manufactured using ISO 9001 Certified Quality Program. |
EMC | EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV EN 61000-4-3: 10V/m EN 61000-4-4: Signal and DC-Net: 1 kV EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV |
Ordering Info
TEC300 |
||
CPU | Ampere® Q32-17 | |
GPU | MXM RTX A500 | |
RAM | Up to DDR4-4TB | |
USB 3.0 | 4 | |
VGA | 1 | |
DP | 4 | |
CAN BUS | 2 | |
COM | 1 | |
GLAN | 2 | |
10G SFP+ LAN | 2 | |
Power |
DC 18V-36V |
AV 100~240V |