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Micro-Grid Computer with Intel® 10th Gen (Cometlake-S) i9-10900TE processor, Extended range of Temperature Support from -20°C to 60°C

  • 10th Generation Intel® Core™ i9-10900TE Cometlake-S Processor
  • DDR4- Up to 64GB
  • 2x SSD – RAID 0/1
  • FTDI Security on Board
  • Multi Display with DisplayPort, HDMI
  • 12V DC-IN
  • 90V~260V AC-DC or 48V DC-IN Redundant PSU for optional
  • HSR/ PRP Ethernet board for Optional


  SCHX4 Datasheet




A Microgrid is a small scale, a type of local electric subsystem that combines power from distributed energy generation sources, connected to the general grid at a single point. A Microgrid is a self-contained power system that has the ability to locally generate, distribute, and store energy. It also is a localised energy grid, which is generally linked to the main grid but can disconnect automatically and function as its own independent grid when necessary. This connection also can be acted as a switch that makes it possible to disconnect a Microgrid from the public grid (should anything happen to the main grid such as a blackout.) and operate it temporarily in island mode.

A Microgrid can be powered by distributed generators, batteries, and/or renewable resources like solar panels. Depending on how its requirements are managed, a Microgrid might run indefinitely.

How does Micro-Grid work?

Microgrid is including three essential sections:

1.Local energy (such as photovoltaic panels, wind turbines, heat pumps, biomass plants, hydroelectric turbines, etc.) and an additional back-up supply of energy (power generators).

2. Storage system: batteries, a supply of water for pumped-storage hydroelectricity.

3. Smart management system to ensure the continuous balance between electricity generation and demand.

A fully functioning Microgrid computer system is important for ensuring all processes work correctly and that energy is always being distributed in an efficient manner. 7Starlake provides state-of-the-art solutions for substation automation and Micro-Grid applications for both public utilities and enterprises. Our rich experience in this industry, coupled with our innovative work on the latest technologies, enables us to develop market-specific solutions for computing and communication applications in this domain.

SCHX4 is designed especially for Microgrid customer such as SCHNEIDER with a highly efficient and powerful computing performance driven by the Intel 10th Gen, Cometlake-S i9-10900TE, in addition, SCHX4 system also supports a wide range DC-in from 12V to 24V, and accepts the extend range of temperature from -20°C to 60°C (CPU Full Speed with no throttling @ 50°C). SCHX4 passes the MIL-STD 810G compliance which can operate successfully in any harsh environments.



Grid Connected:
The microgrid operates in parallel with the grid, making your community more sustainable and reducing your energy consumption from the grid.

Grid Islanded:
In this mode, the microgrid will power all the critical loads in the community on the utility distribution network when there is no grid power. All of the facilities will stay powered during these extreme events.

Grid Connected:
The microgrid operates in parallel with grid and has the ability to import and export to the grid in response to appropriate price signals. This configuration requires sophisticated controls, testing, and integration to manage interaction with grid.

Grid Islanded:

Main features

7STARLAKE’s Microgrid system can provide an optimized IEC 61850 PRP/HSR architecture which integreted scalable for easy modification of functionalities and extension of the substation. PRP/HSR network will require an efficient and cost effective solution in order to construct a seamless/bumpless communication infrastructure to ensure maximum system availability. Moreover, the system have a RAID function support an assortment of hard drives connected and set up in ways to help protect or speed up the performance of a computer’s disk storage. Thanks to the integration FDTI and TPM module, Operating systems can require an authentication (involving a password or other means) to protect keys, data or systems. Finally, the redundant power supplies can provide two power modules in one power supply for continual monitoring for the most reliable power solution for non-stop applications.


Operating Temp.
-20°C to 60°C ( ambient with air flow )
Model SCH-X4
CPU Intel® 10th Gen Core™ i9-10900TE (Cometlake-S) Processors, AMI® UEFI BIOS CODE
Chipset Q470
Memory 2x Dual Channel DDR4 2400/2600 MHz, 260-pin SO-DIMM, Up to 64GB
GPU Intel® UHD Graphics
Display Port DP1.4, Resolution up to 4096×2160@60Hz
HDMI HDMI 2.0a, Resolution up to 4096×2160@60Hz
Storage Device 1x PCIe x 16 (Gen3, Support riser card x8/x8, x8/x4/x4 )
1x M.2 (Key E, 2230) with PCIe x1 and shared USB2.0 for Wireless
1x M.2 (Key E, 3042) with shared USB2.0 and SIM for 4G
1x M.2 (Key E, 2280) with PCIE x4 and SATA3 for SSD
1x SIM socket connected to M.2 key B
2 x Intel Gigabit Ethernet LAN Interfaces (10/100/1000 ,10/100/1000/2500 Mbps)
Front I/O
DisplayPort 2x DP 1.4
HDMI 1x HDMI 2.0a
Ethernet 1x 1 Gigabit Ethernet LAN, 1x 2.5 Gigabit Ethernet LAN
USB Port 4x USB3.2 Gen2 standard-A connectors
Serial Port 2x RS232/422/485
Audio Port 1x Line-Out, 1x MIC-In connector
DC-IN 1x 4P Rugged Terminal connector
Applications, Operating System
Applications Commercial and Military Platforms Requiring Compliance to MIL-STD-810
Embedded Computing, Process Control, Intelligent Automation and manufacturing applications where Harsh Temperature, Shock, Vibration, Altitude, Dust and EMI Conditions.
Used in all aspects of the military.
Operating System Windows 10 64bit
Ubuntu16.04, Ubuntu18.04, Fedora 28
Dimension (WxDxH) 362 x 250 x 70 mm
Weight TBD
Chassis Aluminum Alloy, Corrosion Resistant.
Finish Anodic aluminum oxide (Color Iron gray)
Cooling Natural Passive Convection/Conduction. No Moving Parts
Connectors DC-IN : PHOENIX CONTACT 1776715
RJ45 Ethernet : RTB-19GB9J1A
HDMI + DP : JKCR Display and HDMI Female
Ingress Protection Dust Proof (Similar to IP50)
MIL-STD-810G Test Method 507.5, Procedure II (Temperature® Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20® 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 ® 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
Operating Temperature -20°C to 60°C (ambient with 0.7m/s airflow)
Storage Temperature -40°C to 85°C
EMC CE and FCC compliance


Intel® Core™ i7-10700TE/i9-10900TE Processor 

Thermal Point Testing Temp.
CPU Frequency (GHz) 3.69 3.69 3.69 3.69 1.99~3.69 1.99~3.69 1.99~3.69
CPU Heatsink 19.2 20.1 60 66.4 71.1 75 81.9
CPU Die 24.5 25.6 70 71.7 75.5 78 77.3
CPU T-J (℃) 39℃ 42℃ 89℃ 90℃ 78~98℃ 80~99℃ 83~100℃
Test Configuration



CPU Type Intel® Core™ i7-10700TE Processor 2.0 GHz
PCH Intel Q470E
Memory Innodisk 8GB SOD DDR4 2666 X2
SATA port 1 InnDisk 3MG2-P SSD 64G
DP Dell U2312
LAN1 ~ LAN2 LAN (Loopback)
USB1~USB4 1A cement resistor
COM Com port loopback
Test Software Burnin test v9.0 XTU CPU STRESS,FU MARK
Chamber KSON THS-b4t-150
Chipeng SMO-3
Test Equipment FSP060-DBAE1、PROVA 11_AC/DC mA clamp meter、Agilent U1252B



 Datasheet_SCHX4_220308 SCHX-403 System test report _20211126

 TMXD2109000472DE (SCH-X403) EN 55032&35

 TMXD2109000473DE (SCH-X403) FCC Part 15 B