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SCH300

IEC-61850-3 , IEEE-1613 Substation Fanless Computer, with Intel® Core™ 9th Gen. i9/i7/i5 Processors, 4x PoE, 6x RS232/422/485 ,Operating Temperature -20°C to 60°C

  • Intel® Core™ i7-9700TE, 8C, 1.8/3.8GHz, 12MB cache, TDP 35W
  • 2x DDR4-2666MHz, SO-DIMM up to 64GB
  • 2x 2.5” Easy swap SSD Tray
  • 4x PoE ( Up to 10 PoE for Optional)
  • 2x RJ45 LAN or M12
  • 4x USB3.0, 2x USB2.0 ,1x DP, 1x DVI
  • 6x RS232/422/485
  • 8-bit Isolated Digital I/O (4x DI, 4x DO),
  • HSR/PRP Dual LAN Card for Optional
  • 9V~48V DC-IN
  • -20 °C to 60°C

 

 SCH300 Datasheet

 SCH300 User Manual

 

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Description

Gateways are rugged communication devices collecting numerous data, such as metering, status, events and fault report from any protection device while sending this information upstream to a control center, transfering commands issued from the control center to other devices. One example of a particular need for gateways is in the energy industry. The energy industry requires specific types of devices using specific protocols. With PLCs/PACs becoming popular in these applications, gateways has grown into a necessary part of Substation Automation Systems, and its reliability may affect the safety of whole system at a station level.

As a leading company specialized in energy related application, 7StarLake’s experienced team designed an extremely reliable Gateway system SCH300. Powered by Intel 9th Gen. Core i7-9700TE processor, SCH300 owns highly efficient processing capability to deal with a large amount of data delivering between IEC-61850 devices and the Control Center. In advantage of other outstanding features, such as 10 x LAN port and 2 x COM (up to 16 DIO by request), SCH300 is an undoubtedly best choice for Gateway application in Substation.

 

Specifications

Operating Temp.
-40°C to 60°C
System
CPU Intel® Core™ i7-9700TE, 8C, 1.8/3.8GHz, 12MB cache, TDP 35W
Memory Type 2x DDR4-2666MHz SO-DIMM up to 64GB
Expansion Slot 2x I/O Expansion Slots
1x MXM 3.1 Slot
Storage Device 2x 2.5”Easy swap SSD Tray
Front I/O
Power Input 9V~48V DC-IN
USB 4x USB3.0, 2x USB2.0
Display 1x DP, Resolution up to 4096×2160@60Hz
Ethernet 2x RJ45 LAN or M12 (6 or 10 RJ45 LAN for Optional)
USB 2x USB2.0
DVI 1x DVI
COM 6x RS232/422/485 (2 or 10 COM for Optional)
DIO 8-bit Isolated Digital I/O (4x DI, 4x DO
TPM TPM module onboard
Optional
HSR/PRP HSR/PRP Dual LAN Card
COM 10x COM Ports  Card
PoE 4x PoE  or 4x  RJ45 LAN
PoE 4x PoE  or 4x M12 LAN
OS support list
Windows Windows 10 64Bit
Linux Ubuntu14.04, Fedora 20/23, RedHat Linux EL 7.1/7.2
Mechanical and Environment
Power Requirement 9V~48V DC-IN
Dimension 170 x 264 x 250 mm ( W x D x H )
Operating Temp. -20°C to 60°C
Storage Temp. -40°C to 85°C
Relative Humidity 5% to 95%, non-condensing
Certification CE, FCC, MIL-STD 810G Compliance
System Design Fanless
Mounting Rackmount Cube
Test Standard
MIL-STD-810G Test Method 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
EMC CE, FCC compliant
Green Product RoHS, WEEE compliance
Ordering Information
SCH300 Cube Fanless Computer for EcoStruxure Computer with Intel. 9th Core i7-9700TE Processor, 2x RJ45 LAN , RAID 0/1 support, TPM onboard, HSR/PRP for optional,  8x COM Ports for optional, Wide range 9V~48V DC-IN, Operating Temperature -20°C to 60°C
SCH300-PO Cube Fanless Computer for EcoStruxure Computer with Intel. 9th Core i7-9700TE Processor, 4x PoE , 2x RJ45 , RAID 0/1 support, TPM onboard, HSR/PRP for optional,  8x COM Ports for optional, Wide range 9V~48V DC-IN, Operating Temperature -20°C to 60°C

CPU

 

Intel® Core™ i7-9700TE Processor (up to 3.8 GHz, 8 cores)

Thermal Point Testing Temp.
-40°C
-20°C
0°C
+25°C
+50°C
+55°C
+60°C
CPU T-J 16 58 68 75 91
CPU Die 11.8 38.6 71.9 76 81.5
CPU Heat sink 8.2 34.7 67.8 72 77.3
Δ1=(TJ-Die) 4.7 5.0 5.0 7.0 7.0
Δ2=(Die-Heat Sink) 4.7 5.0 5.0 6.0 5.0
CPU Frequency (GHz) 3.15 3.02 3.02 2.68 2.57 2.45 2.41

Intel® Core™ i7-8700T Processor (up to 2.4 GHz, 6 cores)

Thermal Point Testing Temp.
-40°C
-20°C
0°C
+25°C
+50°C
+55°C
+60°C
CPU T-J 16 77 95 99 100
CPU Die 11.8 38.6 71.9 76 81.5
CPU Heat sink 8.2 34.7 67.8 72 77.3
Δ1=(TJ-Die) 4.7 5.0 5.0 7.0 7.0
Δ2=(Die-Heat Sink) 4.7 5.0 5.0 6.0 5.0
CPU Frequency (GHz) 2.83 2.85 2.66 2.97 2.26 2.18 2.19

Intel®i7-8700 Processor( up to 3.2 GHz,6 cores)

Test 50°C with air flow

Description System Top Sink CPU Die CPU T-j CPU Freq
100%CPU Loading
with Graphic

50°C with hot air flow

 71.4 68.8 100 3.1 GHz
100%CPU Loading
without Graphic

50°C with hot air flow

 70.4 73.2 100 3.2 GHz

Test 60°C with air flow

Description System Top Sink CPU Die CPU T-j CPU Freq
100% CPU Loading
with Graphic

60°C with hot air flow

 76.8 81.5 100 2.99 GHz
100% CPU Loading
without Graphic

60°C with hot air flow

 75 79.6 100 3.15 GHz

Test 50°C with no air flow

Description System Top Sink CPU Die CPU T-j CPU Freq
100% CPU Loading
with Graphic

50°C without air flow

 78 81.1 100 3.05 GHz
100% CPU Loading
without Graphic

50°C without air flow

 77 81.1 100 3.06 GHz

Downloads

 

 SCH300_Vibration_Shock_Test_Report

 SCH3X1_IEC61850_TEST REPORT – 0916

 T210708D08-D (SCH-3X1) FCC Part 15 B

 T210708D08-E (SCH-3X1) EN 55032&35

 Verification – CE

 Verification – FCC

 

 

 

 

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