7SL-3500

Description

The 7SL-3500 VPX System is a modular Military Rugged ATR enclosure, geared for 3U OpenVPX designs. The versatile design allows multiple customizable conﬁgurations based on proven components and design techniques. 7SL-3500 Hybrid conduction cold plate assisted by forced air sets with aggregate power demands over 300W, assisted by liquid up to 600W. Custom and standard 5 to 6 slot backplanes with VPX and SOSA aligned slot proﬁles in combinations supporting high speed signal processing applications. Scalable to multi CPU-GPU-FPGA requirements Designed expressly for Gen 4.0 ultra-high wattage military systems.

7StarLake scalable and customizable, rugged VPX ATR System enables compute-intensive, SWaP constrained mission-critical applications for deployment in the world’s most demanding military and aerospace environments.

Specifications

System
CPU	Intel^® Xeon^® W-11865MRE processor (formerly Tiger Lake-H) Up to 8 cores (TDP 45W)
Memory type	Up to 64 GB DDR4-2666 soldered with ECC
GPU	Option 1 : NVIDIA RTX A4500, 16GB GDDR6, 5,888 CUDA Option 2 : NVIDIA RTX 5000, 16GB GDDR6, 3,072 CUDA
BIOS	Dual 256Mbit SPI flash
Security
TPM	Discrete TPM 2.0 chip
Storage
SATA	1x SATA 6Gb/s
M.2	1x M.2 2242 on top side (M-key)
Side I/O (D38999)
X1/X2	2x USB3.0
X3/X4	2x GbE
X5	1x DVI
X6	1x DC-IN
BNC	4x
Secure	1x AES KEY
CMOS	1x
GND	1x
Power Button	1x
OS support list
OS	Windows 10, Linux (kernel 5.4 and higher)
Application
Application	Military Platforms Requiring Compliance MIL-STD-810 Embedded Computing and applications subject to Harsh Temperture, Shock, Vibration, Atitude, Dust and EMI Conditions.
Environment
Power Requirement	18V~36V DC-IN
Dimension	192.9 x 389.5 x 269 mm
Weight	13 KG
Operating Temp.	-40°C to 60°C
Storage Temp.	-40°C to 85°C
MIL-STD-810 Test	Method 500.5, Procedures I and II (Altitude, Operation): 12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia) Method 500.5, Procedures III and IV (Altitude, Non-Operation): 15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) Method 507.5, Procedure II (Temperature & Humidity) Method 509.7 Salt Spray (50±5)g/L Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration) Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration) Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6, Shock-Procedure I Operating (Mechanical Shock)
Reliability	No Moving Parts; Passive Cooling. Designed & Manufactured using ISO 9001 Certified Quality Program.
Safety & EMC
EMC	EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV EN 61000-4-3: 10V/m EN 61000-4-4: Signal and DC-Net: 1 kV EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV
MIL-STD-461	CE102 basic curve, 10kHz – 30 MHz RE102-4, (1.5 MHz) -30 MHz – 5 GHz RS103, 200 MHz – 3.2 GHz, 50 V/m equal for all frequencies
MIL-STD-1275	Steady State – 20V~33V, Surge Low – 18V/500ms, Surge High – 100V/500ms Emitted spikes Injected Voltage surges Emitted voltage surges Voltage ripple (2V) Voltage spikes Starting Operation Reverse polarity

Thermal Solutions

7StarLake Advanced Thermal Solutions

From ships at sea to high-altitude Drone, 7StarLake ATS solutions enable
electronics survivability in the harshest environments. As an ever-increasing number of data acquisition methods are utilized in military and aerospace, the need to convert that rising data tide into precise, real-time action only escalates.
Applications like object targeting , ground vehicles tracking, thermal image monitoring, and multiple simultaneous sensors feeds. When a wealth of such sources need aggregation and immediate analysis, potentially with graphical visualization output to any number of displays, VPX-based systems can ensure proven solutions.

Conduction Cooled – 7SL-3500CC

Conduction cooled SBC have traditionally been deployed in applications where heat evacuation with an airﬂow is impractical.

As the most common heat-transfer device available, heat pipes can manage the transfer of heat between two solid interfaces effectively. Combining the advantages of thermal-conductivity and phase transition, heat pipes are extremely light-weight compared with traditional cooling methods.
For the highest thermal dissipation and thermal density, heat pipes can be very effective in conduction cooled environments.
The heat pipes are embedded in a symmetrical topology from the sidewall, allowing the assembly to be less sensible to gravity or acceleration.

Force Air Conduction Cooled – 7SL-3500FA

7SL-3500 Hybrid conduction cold plate assisted by forced air sets with aggregate power demands over 300W
Internal recirculation fans ensure dry air is forced across conduction or air-cooled payload modules, minimizing hot-spots and dissipating heat homogeneously

Liquid Cooled – 7SL-3500LC

Advanced conduction liquid cooling systems that enables higher powered, compact electronics in ruggedized military, aerospace applications.

7SL-3500-LC is a VPX-REDI Liquid-cooled enclosure utilizing side-wall cooling within the enhanced wedge-lock guide rails (increased 50% contact area) cooling of standard conduction Liquid Cooling Hardware Implementations. In order to effectively reduce overall temperature and prevent the leakage of the liquid, 7StarLake innovated a unique heat exchanger which integrating Conduction Liquid Cold Plate (C.L.C.P.) building in most advanced “Gun Drilled”, which with 4 pipes (each pipe 10mm x 10mm x 400mm) to dissipate max 1KW heat on the 3/4 ATR system.