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HORUS430-X2A45

Military Dual MXM A4500 GPU Server with Intel® Xeon®Scalable , MIL-STD 461 EMI 18V~36V DC

  • 2U Short Depth (450mm) Rugged VMware GPU Workstation
  • MIL-STD-810 Thermal, Shock, Vibration, Humidity
  • MIL-461/1275 EMI/EMC Compliance
  • 16 Cores Intel® Xeon® Silver 4314 VMware Support
  • 2x NVIDIA RTX™ A4500 MXM (5888 CUDA, 16GB GDDR6)
  • Up to 2TB DDR4 ECC RDIMM
  • 2x 10-Gigabit Ethernet support
  • Windows 10/Server, Linux, VMware Compatible
  • 18V to 36V DC MIL-1275/461 Power Supply ( Options )
  • Extreme Temperature -20°C to +55°C

 

 HORUS430-X2A45 Datasheet

 

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Description

HORUS430-X2A45 is a cutting-edge 2U short depth Military Dual MXM A4500 GPU Server, powered by the formidable Intel® Xeon® Silver 4314 (3.4GHz, 16 Cores, 32 Threads, 24MB Cache), and equipped with dual NVIDIA RTX™ A4500 MXM (5888 CUDA, 16GB GDDR6) . This powerhouse is purpose-built for mission-critical Edge AI applications, delivering superior computing capabilities that effortlessly handle heavy workloads.

With its exceptional processing power, HORUS430-X2A45 sets new standards for Edge-AI workstations, seamlessly executing tasks such as facial recognition, target acquisition, and Network Visualization at unprecedented speeds. On top of that, its 2 x 10GbE Fiber capability ensures ultra-fast data transmission from external sensors, offering near-zero latency and impeccable synchronization for time-critical operations. HORUS430-X2A45 redefines what’s possible in Edge AI computing, providing an unmatched solution for your most demanding tasks.

 

Ultra-High Performance Intel® Xeon® Scalable Processor

  • Ultra High Performance Intel® Xeon® Silver 4314(16 Core)
  • Dual NVIDIA RTX4500 MXM (5888 CUDA)
  • 2x 10-Gigabit Ethernet support
  • Up to Up to 2TB DDR4 ECC RDIMM
  • Windows 10/Server, Linux, VMware Compatible
  • MIL-STD-810G Thermal, Shock, Vibration, Humidity
  • MIL-STD 461 EMI/EMC 18V~36V DC-IN(28VDC) Extreme Temperature Support -20~+60°C

 

Specifications

System

CPU Intel® Xeon® Silver 4314(Frequency 2.4GHz, Turbo Boost Frequency up to 3.4GHz), 16-Core, 32 Thread Support, 24MB Smart Cache. Build-in Turbo Boost Technology 2.0, Hyper-Threading support.
Memory type Up to 2TB ECC RDIMM DDR4 3200 MHz
Chipset SoC, integrated with CPU
GPU 1 NVIDIA RTX A4500 MXM

5888 CUDA® Cores, 16GB GDDR6 Memory, 256-bit

GPU 2 NVIDIA RTX A4500 MXM

5888 CUDA® Cores, 16GB GDDR6 Memory, 256-bit

Display

GPU ASPEED AST2400
Resolution Up to 1920×1200@60Hz 32bpp

Storage

HDD/SSD 2 x 2.5″ SSD ( Options for NVMe U.2)

Ethernet

Ethernet Quad Gigabit Ethernet via Intel® i350-AM2 Dual 10GBase-T LAN via Intel®X557-AT2 Realtek RTL8201N PHY (dedicated IPMI)

I/O

X1 1 x 10G SFP+ with D38999 connector
X2 1 x 10G SFP+ with D38999 connector
X3 1 x 1G LAN with D38999 connector
X4 1 x 1G LAN with D38999 connector
X5 2 x COM with D38999 connector
X6 4 x USB2.0 with D38999 connector
X7 1 x DVI with D38999 connector
X8 1 x DVI with D38999 connector
DC-IN 1 x DC-in with D38999 connector
SSD/HDD Tray 2 x Dual 2.5″ HDD/SSD Easy Swap Tray

Power Requirement

Power Input MIL-STD 461 EMI Filter DC-DC  18V to 36V

Applications, Operating System

Applications Military Platforms Requiring Compliance to MIL-STD-810 ; Transportation, Mission Criticial applications where Harsh Temperature, Shock, Vibration, Altitude, Dust and EMI Conditions.
Operating System Windows Server 2019, Windows Server 2019 64bit, RedHat EL Linux 8.1, RedHat EL Linux 8.1 64bit,  Fedora 30/31, Ubuntu 20.04 LTS, Oracle Linux 8.1, CentOS 8.1, Vmware ESXi 7.0 GA x64, FressBSD 11.3 64bit, FreeBSD 12.1 64bit

Physical

Dimension( WxDxH ) 430 x450 x 88 mm
Weight 10.6 Kg (23.37lbs)
Chassis SECC + Aluminum Alloy, Corrosion Resistant
Finish Anodic aluminum oxide (Color Iron gray)
Cooling Natural Passive Convection/Conduction. No Moving Parts

Environmental

MIL-STD-810 Method 501.5, Procedure I (Storage/High Temperature)

Method 501.5, Procedure II (Operation/High Temperature)

Method 502.5, Procedure I (Storage/Low Temperature)

Method 502.5, Procedure II (Operation/Low Temperature)

Method 503.5, Procedure I (Temperature shock)

Method 507.5, Procedure II (Temperature & Humidity)

Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration)

Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration)

Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock)

Method 516.6, Shock-Procedure I Operating (Mechanical Shock)

Method 500.5, Procedures I and II (Altitude, Operation): 12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia)

Method 500.5, Procedures III and IV (Altitude, Non-Operation): 15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia)

Reliability No Moving Parts; Passive Cooling.

Designed & Manufactured using ISO 9001/2000 Certified Quality Program.

MIL-STD-461 CE102 : 10kHz – 30 MHz

RE102-4 : 1.5 MHz -30 MHz – 5 GHz

RS103 : 200 MHz – 3.2GHz, 50 V/m equal for all frequencies

Operating Temperature 0 to 50°C
Storage Temperature -40 to 85°C
Relative Humidity 5% to 95%, non-condensing.
Designed to Meet Items ( Options )
CS101, CS114, CS115, CS116, CE106, RE103, RS101
MIL-STD-1275 Steady State 20V-33V
Surge Low 18V/500ms
Surge High 100V/500ms