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Military IP66 Mission GPU Computer

  • MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
  • IP66 Chassis with D38999 connectors
  • Intel® 11th Gen. Tiger Lake(H) W-11865MLE Processors, up to 8 cores
  • Up to 96GB DDR4 SO-DIMM, non-ECC and ECC
  • Soldered 64 GB NVMe
  • NVIDIA RTX™ A1000/A2000 4GB/8GB GDDR6 memory 2048/2560 CUDA cores
  • IP65 1 x 2.5” SATA SSD Easy Swap Tray
  • MIL-STD 461 18V~36V DC-Input (Options for MIL-704/1275)
  • Extreme Temperature : -40°C to +60°C
  • Dimensions : 250 x 325 x 100 mm (WxLxH)

Special Request :

  • Frame Grabber : 4xCH HD-SDI
  • Discrete IO : 4x DI/ 4x DO
  • 10GbE : Dual 10GbE (Intel X710) Ethernet Ports
  • Dual Redundant MIL-STD-1553 connections
  • Dual ARINC 429 input connections
  • Conformal coating on electronics


 AV600TH Datasheet

 AV600 e-DM




AV600TH is driven by Intel® 11 Gen. Tiger Lake-H Processors, integrated Intel® UHD Graphics (Xe architecture). Tiger Lake H processor is built on 10nm SuperFin Technology, up to 8 CPU cores and 4.5 GHz frequency. It is high computing performance and flexibility for heavier IoT workloads, the platform posts significant performance gains gen-over-gen with up to 32 percent gain in single-thread performance. It also features in high-bandwidth, high speed I/Os for expansion and peripherals.

AV600TH highlights on its rugged design and high functionality, the system especially installed MIL-STD Amphenol type connector and full IP66 protection allow system withstand in any kind of harsh environment. AV600TH supports extended temperature from -40°C to 70°C and MIL-STD-461 18V~36V DC-input Power supply which can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself.

ARINC 429 is the worldwide standard for data transmission in aircraft electronics. It is adopted mostly for commercial aircraft and transport aircraft network protocol standard. Communications, guidance, altitude, altitude reference, flight management, and more are all needed to work together to accomplish a successful flight. The physical connection wires are twisted pairs carrying balanced differential signaling.

The ARINC 429 unit of transmission is a fixed-length 32-bit frame, which the standard refers to as a ‘word’. The bits within an ARINC 429 word are serially identified from Bit Number 1 to Bit Number or simply Bit 1 to Bit 32.





CPU Intel® 11 Gen. Tiger Lake-H Processors, up to 8 cores, integrated Intel® UHD Graphics

– Intel® Xeon® W-11865MLE, 25W Tiger Lake 11th Gen, 8C, Freq. 1.5/4.5 GHz, 24MB cache

Memory type Up to 96GB DDR4 SO-DIMM, non-ECC and ECC
CHIPSET Intel® RM590E (support ECC, with Xeon CPU) /QM580E

4GB/8GB GDDR6 memory, 2048/2560 CUDA cores

Expansion Slot 2x Full-size mini PCIe (1 with mSATA supported)

-1 with mSATA/USB2.0/PCIeX1 support

-1 with SIM/USB2.0/PCIeX1 support

1 x 2280 M key (SATA only)


SATA 1x 2.5” SSD, Hot Swappable SSD/HDD slot
M.2 1x 2280 M key (SATA only)


Ethernet (Internal) 2 x 10/100/1000 Ethernet Ports

Front I/O

X1 2x GbE LAN + 2x USB2.0 + 1x COM(RS232) with D38999 connector
X2 1x VGA + 4x DI/4x DO + 3x RS422 with D38999 connector
X3 1x USB3.0 , with D38999 connector
X4 1x USB3.0 , with D38999 connector
X5 1x DC-in , with D38999 connector
LED 1x SSD/HDD LED indicator
switch 1x IP65 power button , with LED indicator
SSD 2x 2.5”Easy swap SSD Tray


Power input MIL-STD -461 18V~36V DC-Input

Application, Operating System

Application Military Platforms Requiring Compliance to MIL-STD-810 Where Harsh Temperature, Shock, Vibration, Altitude, Dust and MIL-461 EMI Conditions.
Operating System Windows® 10 64-bit / Linux (support by request)


Dimension 250 x 325 x 100 mm (LxWxH)
Weight 11 KG
Chassis Aluminum Alloy
Heatsink Heatsink Aluminum Alloy, Corrosion Resistant


Green Product RoHS, WEEE compliance
Operating Temp. -20°C to +60°C
Storage Temp. -40°C to +85°C
Relative Humidity 5% to 95%, non-condensing
MIL-STD-810 Method 507.5, Procedure II ( Temperature & Humidity )
Method 516.6 Shock-Procedure V Non-Operating ( Mechanical Shock )
Method 516.6 Shock-Procedure I Operating ( Mechanical Shock )
Method 514.6 Vibration Category 24/Non-Operating ( Category 20 & 24, Vibration )
Method 514.6 Vibration Category 20/Operating ( Category 20 & 24, Vibration )
Method 501.5, Procedure I ( Storage/High Temperature )
Method 501.5, Procedure II ( Operation/High Temperature )
Method 502.5, Procedure I ( Storage/Low Temperature )
Method 502.5, Procedure II ( Operation/Low Temperature )
Method 503.5, Procedure I ( Temperature shock )
Reliability No Moving Parts; Passive Cooling.
Designed & Manufactured using ISO 9001 / 2000 Certified Quality Program.
MIL-STD-461 CE102  :   10 KHz – 10 MHz
RE102-4 : 1.5 MHz -30 MHz – 5 GHz
RS103 :    200 MHz – 3.0 GHz – 5.0 GHz, 50 V/m equal for all frequencies
Designed to Meet Items ( Options )
CS101, CS114, CS115, CS116
CE106, RE103, RS101
MIL-STD-1275 Steady State 20V-33V
Surge Low 18V/500ms
Surge High 100V/500ms

Ordering Information


Model Name Description
Intel® 11th Gen. Tiger Lake(H) W-11865MLE, RTX A1000 MXM, 1x 2.5” SATA SSD Easy Swap Tray, 18V-36V DC-IN, support MIL-STD-461, MIL-STD-810. with MIL-DTL-D38999 Connectors, Operating Temp. -40 to +60°C
AV600TH-A20-PA1 Intel® 11th Gen. Tiger Lake(H) W-11865MLE, RTX A2000 MXM, 1x 2.5” SATA SSD Easy Swap Tray, 1x 3D-SDI Capture Card, 18V-36V DC-IN, support MIL-STD-461, MIL-STD-810. with MIL-DTL-D38999 Connectors, Operating Temp. -40 to +60°C

Thermal Solution




 AV600 MIL-810 514.6 Operation

 AV600 MIL-810 514.6 None-Operation

 7StarLake_MIL-STD-461G_Test Report-CE102,RE102,RS103_AV600_0