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3.5″ SBC Intel® Skylake-U Core™ i7-6600U Processor, 2 x DDR4 SO-DIMM, 2 x Display Port, 1 x LVDS, 6 x USB, 2 x COM, 9~ 36V DC-IN, -20 to 85°C


  • Support 6th Generation Intel® Core™ i7-6600U Processor
  • 2 x SO-DIMM, supports Dual Channel DDR4 1866/2133 up to 32GB
  • 1 x Full-size mPCIe, 1 x Half-size mPCIe
  • Multi display: 2 x Display Port ; 1 x Dual Channel 24 Bit LVDS
  • Dual LAN Ports (1 x  Intel® I210-IT & 1 x Intel® I219-LM GbE LAN)
  • 2 x COM Ports: 1 x RS-232, 1 x RS232/422/485
  • 6 x USB Ports: 4 x USB 3.0, 2 x USB 2.0
  • Wide range 9~36V DC-IN
  • Extended operating temp. -20 to 85°C


 OXY5361A Datasheet

  OXY5361A User Manual






OXY5361A is a highly integrated 3.5″ rugged SBC driven by Intel® Skylake U SoC i7-6600U soldering onboard With processor soldered onboard can significantly enhance the resistance of vibration and shock. Processor supports graphics (HD Graphics 500 Series) and CPU performance and equips with rich legacy I/O features such as: 2 COM Ports; 8 Bit DIO; 6 USB Ports.

With 2 DisplayPort and a Dual Channel 24 Bit LVDS, OXY5361A can fulfill diverse needs of modern day display & monitor control applications.

OXY5361A can operate in harsh environment under temperature range from -40°C to 85°C and avoid damage from sudden surge of voltage with its 9V to 36V DC input design.

Rich I/O interface – Extensive Functionality

Rich I/O design endows OXY5361A with the ability to comprehend present day automation devices, display, and other applications that require extensive I/O features. With 2 COM, 6 USB, 2 LAN, and dual Channel 24-bit LVDS, OXY5361A provides a wide array of choices to expand and connect to different devices.

Extended Temperature Operation

7STARLAKE aims to provide excellent performance to all types of temperature zone. From component selection to layout design, we dedicate our knowledge to make sure that our boards can stand extreme temperature. OXY5361A can operate from -20°C to 85°C, our strict manufacture procedure guarantees supreme performance in severe environment.

Efficient thermal solution

A tailor-made heat spreader is what 7STARLAKE provide for engineers to reduce mechanical design period also ensures the highest efficacy for dissipation. For OXY5361A, the customized heat sink is placed on top of the CPU and chipset, acting as the medium that exchanges the heat to the surrounding atmosphere. The highly efficient aluminum heat sink has a thermal conductivity to absorb the heat generated by the pumping CPU.


CPU Type Intel® Skylake-U series , BGA Type
Intel® Core™ i7-6600U Processor (4M Cache, 2.6GHz)(15W)
Intel® Core™ i5-6300U Processor (3M Cache, 2.4GHz)(15W)
Intel® Core™ i3-6100U Processor (3M Cache, 2.3GHz)(15W)
Memory type 2 x SO-DIMM DDR4 2133 MHz up to 32GB
Super I/O Fintek F8786E
Watchdog 1-255 sec.
Expansion Slot 1 x Full-size mPCIe/mSATA
1 x Half-size mSATA
Chipset Intel® Integrated
DisplayPort Max. resolution 4096 x 2304
LVDS Dual Channel 24bit LVDS
Display Type Display Port, LVDS
Codec Realtek ALC888 High Definition Audio Codec
Chipset 1 x Intel® I210-IT , 1 x Intel® I219-LM GbE LAN
(support 10/100/1000 Mbps for 2 x RJ45 ports)
Boot from LAN Yes for PXE
Rear I/O
DisplayPort 2 x DisplayPort
Ethernet 2 x RJ45
USB 4 x USB 3.0
COM 1 x RS232
Internal I/O
SATA 1 x SATAIII (6 Gb/s)
USB 2 x USB 2.0
COM 1 x RS232/422/485
AUDIO Mic-in, Line-in/out

1 x 3W amplifier (Optional)

FAN 1 x CPU fan
LVDS 30-pin connector
DIO 8bit
Mechanical and Environment
Form Factor 3.5″ SBC
Power Type 9~36V DC-IN4-pin ATX power connector,AT/ATX mode support
Dimension 146mm x 101mm (5.7″ x 4″)
Operating Temp. ET : -20 to 70℃

UT : -20 to 85℃

Storage Temp. -40 to 85°C
Relative Humidity 10% to 90%, non-condensing
Standard Compliance
Standard Compliance CE/FCC
OS Support Windows®10 64-bit

Linux(Support by request)



The OXY5361A offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers’ extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

Device Model OXY5361A
Tester Marc Liu
Test Result Pass
Test Temperature High 0°C to 85°C/ Low -40°C to 0°C
Test Time 5 Hours / 2 Hours
Test Standard Reference IEC60068-2
Test Software Burnin test v6.0
Criteria After testing, system can’t halt.


Test Configuration

 Device  Configuration  Manufacturer  Part Number
 CPU Type  Intel® i7-6600U ( 2.60 GHz)  Intel  i7-6600U
 Port2 msata half  innodisk 3me 64G
 Port3 msata  innodisk 3me2 256G
 USB3 ~ USB4  USB Keyboard / Mouse
 LAN1  Intel® I219 GbE  Intel  Intel® I219 GbE
 LAN2  Intel® I210 GbE  Intel  Intel® I210 GbE
 Test Software  Burnin test v8.1、AS SSD、iperf
 Chamber  KSON THS-b4t-150 Chipeng SMO-3  KSON Chipeng  THS-b4t-150 SMO-3

Thermal Measurement

PERFECTRON provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus PERFECTRON conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, PERFECTRON is able to analyze the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in OXY5361A-i7-6600U for one hour, from 50°C to 85°C.