Select Page


1U Fanless System with Intel® Coffee Lake 9th Processor (Up to 65W), 9V~36V DC-IN, Extended Temp. -30°C to 70°C

  • 1U Fanless MIL-STD Xeon Server
  • Intel® Coffee Lake 9th Gen. Xeon E-2278GEL (8C,16T) 2.0/3.9GHz
  • 2x SO-DIMM DDR4 2400/2666 MHz up to 64GB
  • Front IO: 2x 2.5”SATA HDD/SSD Swap Tray, 2x USB2.0
  • Back IO: 2x COM, 4x USB3.1, 2x DP, 2x LAN, 1x Line-out/Mic
  • Wide Range 9V~36V DC-IN
  • Extended Operating Temperature -30°C to 70°C


 ROC286A Datasheet

 ROC286A User Manual




ROC286A is an industrial 19” 1U Rack-mount rugged fanless server. Based on Intel® Coffeelake 14nm Core™ Q370 Chipset, ROC286A can be processed by 8th/9th Processor (up to 65W). It supports up to 64GB of memory capacity, 1 x PCIe x16 Slot 1 x M.2(Key M, PCIe x4 and SATA) Expansion Slot, 6 x USB, 2 x DisplayPort, 1 x HDMI, 2 x LAN, 1 x Line-out/Mic-in, 2 x COM, 2 x 2.5” SATA HDD/ SSD Easy Swap Tray.

With further advantages, for example, HDD/ SSD easy swap tray and multi-expansion slot, we believe that ROC286A is a best choice for those, who are looking for an ideal server to meet the requirements of commercial and industrial platforms, process control, intelligent automation and manufacturing applications.



High Performance Processor Socket LGA 1151 for Intel® Coffee Lake 9th Gen. Xeon E-2278GEL, Core i7/i5/i3/Celeron® (Supports up to 65W) Intel® 8th/9th Processor
Memory type 2x DDR4 SO DIMM up to 64 GB
Chipset Intel® Q370 Chipset
Expansion Slot 1x PCIe x16

1x M.2 (Key M, 2242/2280) with PCIe and SATA Signal


HDD/SDD 2x 2.5” SATA HDD/SSD easy swap tray


Ethernet Intel® I210 & I219LM GbE LAN (support 10/100/1000 Mbps for x2 RJ45 ports)

Rear I/O

Display Port 2x
Ethernet 2x RJ45 Intel® I210 & I219LM GbE LAN (support 10/100/1000 Mbps)
Audio 2x 3.5mm Audio Jacks (1x MIC, 1x Line-Out)
COM 2x RS232/422/485 ( 422/485 select by BIOS)
USB Port 4x USB 3.1(10Gb/s)
DC-IN DC-IN 12V(1x 4P Terminal Block)

Front I/O

Button 1x Power Button w/Indicator LED
Indicator LED 1x HDD
USB Port 2x USB 2.0
Easy Swap SSD Tray 2x

Power Requirement

Power Input 9V~36V DC-IN

Applications, Operating System

Applications Commercial and Industrial Platforms, Embedded Computing, Process Control

Intelligent Automation and manufacturing applications

Operating System Windows 10 64Bit

Ubuntu13.04, Ubuntu13.10, Ubuntu14.04, Fedora 20


Dimension (W x D x H) 430 x450 x 44.4 mm
Weight 8.92Kg
Chassis SECC
Heatsink Aluminum Alloy, Corrosion Resistant
Finish Anodic aluminum oxide


MIL-STD-810G Test Method 507.5, Procedure II (Temperature & Humidity)

Method 501.5, Procedure I (Storage/High Temperature)

Method 501.5, Procedure II (Operation/High Temperature)

Method 502.5, Procedure I (Storage/Low Temperature)

Method 502.5, Procedure II (Operation/Low Temperature)

Method 503.5, Procedure I (Temperature shock)

Green Product RoHS compliance
Operating Temperature w/o Graphic Card (ET: -20 to 60°C; UT: -30 to 70°C) ; w/Graphic Card (0 to 50°C)
Storage Temperature -40 to 85°C
Relative Humidity 5% to 95%, non-condensing
EMC CE and FCC compliance

Thermal Solution

With combination of high CPU computing power and graphic GPU performance generate numerous heat, 7STARLAKE emphasizes on providing exceeding thermal design guarantee system offers superior performance under critical environment. Based on our experience, ROC286 adopts dual side thermal solution, with copper heat spreader directly touches the heat source components processor and graphic GPU to absorb the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid which can provide high efficiency heat transmission, the aluminum heat sink dissipates the heat into surrounding air promptly. Both side thermal solution is mainly for processor. With unique thermal design, 7STARLAKE is capable to integrate high power consumption CPU into 1U such slim size fanless system.