OXY5741B

9th Gen. Intel® Xeon®, Core™ i7 EBX SBC with PCIe/104 Rugged Extreme Temperature -40 to 85°C

  • 9th / 8th Gen Intel® Xeon® / Core™ processor with up to 6 Intel® Xeon® E-2276ME / E-2276ML / Core™ i7-9850HE / i7-9850HL / i5-8400H
  • PCIe/104 stackable bus structure(Type 2)
  • FPE connector ( 1*PCIe x16 or 2*PCIe x8 or 1*PCIe x8+2*PCIe x4)
  • 4x DDR4-2666MHz SO-DIMM, up to 128GB, ECC for Xeon® SKU
  • Multi display” Triple simultaneous displays with 48-bit LVDS+DP
  • 1x M.2 2280 M-key, 2x Full size mPCIe, 1x PCIe/104, 1x FPE
  • Dual GbE, 4x SATA III, 2x RS232/422/485
  • 6x USB3.0, 4x USB2.0
  • Extended operating temp. -40 to 85°C

OXY5741B Datasheet

OXY5741B Manual

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Description

7STARLAKE, the leading pioneer in ruggedised and embedded systems, introduces the latest EBX SBC OXY5741A. The EBX SBC measures 243*146 mm, providing extraordinary computing performance under extreme environment. It is powered by 9th / 8th Gen Intel® Xeon® / Core ™. Featuring Intel’s Xeon E-2276ME and ruggedised open-standard EBX architecture, 7STARLAKE EBX series is built tentatively and triumphs on environmental testing. It still operates effectively under harsh environments ranging from -40°C to 85°C so that it is a perfect solution for defence, transportation, and automation applications. More key functions such as stackable PCIe/104 expansion ability, flexible I/O, and NVMe Gen 3.0 PCIex4 for fast and large capacity storage, all contribute to this versatile architecture that can meet clients’ needs.

Specifications

System
CPU Intel® Core™ i7-9850HE Processor

(6 Cores/12 Threads, 9M Cache, up to 4.40 GHz), 45W

Intel® Core i7-9850HL Processor

(6 Cores/12 Threads, 9M Cache, up to 4.10 GHz), 25W

XEON E-2276ME Processor

(6 Cores/12 Threads, 12M Cache, up to 4.50 GHz), 45W

XEON E-2276ML Processor

(6 Cores/12 Threads, 12M Cache, up to 4.20 GHz), 25W

Intel® Core™ i5-8400H Processor

(6 Cores/12 Threads, 8M Cache, up to 4.20 GHz) TDP: 45W

Memory type 4x DDR4 2666MHz 260 Pin SO-DIMM

(up to 128GB, Xeon® Sku Support ECC)

Chipset CM246
BIOS Core AMI® UEFI BIOS
BIOS Flash SPI Flash
Super I/O ITE 8786
TPM TPM 2.0 (SLB9665)
iAMT iAMT 12.0
Watchdog 1-255 sec. or 1-255 min. software programmable and can be generate system reset
Display
Display Port Resolution up to 4096 x 2304 @ 60Hz
Chipset Intel® UHD Graphics 630
Multi-Display Triple simultaneous display with LVDS + 2x Mini-DP
LVDS 1* Dual Channel 24-bit LVDS, max resolution up to 1920 x 1080 @60Hz (w/auto-dimming support)
Audio
Codec ALC888S
Expansion Slot
M.2 1x M.2 (M-key, type:2280, SATA/PCIe 3.0 x4 NVMe)
miniPCIe 2x Full size (USB/PCIe and 1x Micro SIM Card)
PCIe/104 TYPE 2
FPE 1x FPE slot.
Ethernet
Chipset Intel® I210 & I219LM GbE LAN (10/100/1000 Mbps supported )
WOL Yes
Boot from LAN Yes for PXE
Rear I/O
Display Port 2*mini-DIP Display Port Female 20P 90D
Internal I/O header (No Edge I/O Needed)
SATA 4x SATAIII (RAID 0,1,5) , from 2 up to 4 ports
SATA power 4x
LVDS connector 1x (30 pins) or equal —> W/Auto-dimming supports), Bright light control
LVDS Inverter 1x (10 pins) box header
8 bit GPIO 1x (4in/4out) in a (10 pins) box header
Serial 2x RS232/422/485 (2x 10 pins) box header
SIM card holder 1x (Micro SIM) in mini-PCIe slot
LAN 2x 10/100/1000 Base (20 x 1.0 wire to Board connector)
USB 3.0 4x USB3.0 (2x 20GU 2.0 x 2.0mm box header)
USB2.0 4x USB2.0(2×5 Pins) box header
LPC 1x LPC (10 pins ) box header
Front Panel 1 (2x 5 pins) Power BTN/HDD LED/Reset BTN/PWR LED/Buzzer
Smart Fan 1x CPU Fan —>1x 4 pins for CPU(PWM mode)
Audio 1x MIC-IN / LINE OUT (10 pins) box header
Battery 1x RTC battery holder
Power DC-IN 1x (4 x 2pin) horizontal type
Mechanical and Environmental
Form Factor EBX
Dimension 146 mmX 243mm
Power Type 12V DC-IN
Power Consumption 180W
Operation Temperature -40℃ ~ 85℃(ambient with air flow)
Storage Temperature -40℃ ~ 85℃
Relative humidity 10% to 90%, non-condensing
Standard Compliance
Standard Compliance CE/FCC
OS
OS Support Windows® 10 64-bit

Linux (Support by request)

Modular Architecture
PCIe/104 PCIe/104 (PCI2v3.0, Type2)bus-2x Gen3.0 x4 lanes plus 4x Gen3.0 x 1 lanes

Supports integration with stackable PCIe/104 and /or PCI/104-Express I/O cards

PCI-PCIe bridge adapter required to support PCI-104 and/or PC/104-Plus I/O cards.

FPE FPE B2B connector to support PCIe Gen3.0 x16 lanes

Use this feature configures the PCI-E port Bifuraction setting for a PCI-E port Specified by user. The options are x8x4x4, x8x8 and x16(SK229) 3 cards slots available for PCIe/104 or PCIe adapter cards example:

1.      FPE/PCIe 104 to 4 mini-SAS connectors (SK229)

2.      Mini-SAS PCIe x16 slot(x8 signal_SK228)

3.      Mini-SAS to PCIe x16 slot (x16 signal_SK226/SK230)

4.      Mini-SAS to MXM adapter board(SK224)

Mini PCI/e 2x Full size mini PCIe slot

1x slot dedicated for Mini-PCIe card I/O module (i.e. MIL-STD-1553, ARINC 429, serial, Ethernet, GPS, etc.)

M.2 M.2 2280 slot to support PCIe Gen3.0 x4 or NVMe SSD storage device by jumper setting.
Expansion I/O Support 5 to 6 card slot to support available for PCIe/104 or PCI/104 -Express cards example:

1.      HD-SDI/PAL/NTSCH.264 frame grabber (mPCIe by SK401)

2.      H.264 video recorder/network streaming card (mPCIe SK401)

3.      MIL-STD-1553/ARINC429 (mPCIe by SK401)

4.      CAN data-bus module (mPCIe by SK401)

5.      Ethernet NIC/10GbE LAN switch (SK506, SK502)

Data Storage 4x SATA controllers for SATA III and 1x NVMe SSD can support Data Storage function.

(1)     SATA LAN 0 / (2) SATA LAN 1 (3) SATA LAN 2

(4)    SATA LAN 3 / (5) M.2 2280 NVMe SSD

Labelled Images

Ordering Information

OXY5741B-01UT EBX Industrial Motherboard Intel Intel® 14nm Coffee Lake-H Processor  7 I7-9850HE(Embedded) BGA(FCBGA1440) with 4 x DDR4 SO-DIMM, Dual Intel® GbE LAN, PCIe/104 Type2 & FPE, 12V (-40°C ~ 85°C)
OXY5741B-02UT EBX Industrial Motherboard Intel Intel® 14nm Coffee Lake-H Processor I7-9850HL(Embedded) BGA(FCBGA1440) with 4 x DDR4 SO-DIMM, Dual Intel® GbE LAN, PCIe/104 Type2 & FPE, 12V (-40°C ~ 85°C)
OXY5741B-03UT EBX Industrial Motherboard Intel Intel® 14nm Coffee Lake-H Processor E-2276ME(Embedded) BGA(FCBGA1440) with 4 x DDR4 SO-DIMM, Dual Intel® GbE LAN, PCIe/104 Type2 & FPE, 12V (-40°C ~ 85°C)
OXY5741B-04UT EBX Industrial Motherboard Intel Intel® 14nm Coffee Lake-H Processor E-2276ML(Embedded) BGA(FCBGA1440) with 4 x DDR4 SO-DIMM, Dual Intel® GbE LAN, PCIe/104 Type2 & FPE, 12V (-40°C ~ 85°C)
OXY5741B-05UT EBX Industrial Motherboard Intel Intel® 14nm Coffee Lake-H Processor I5-8400H(Embedded) BGA(FCBGA1440) with 4 x DDR4 SO-DIMM, Dual Intel® GbE LAN, PCIe/104 Type2 & FPE, 12V (-40°C ~ 85°C)

Cable Kit

Video