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SMT835-ZU47DR-2

£8,395.00

 

PCIe ZynqRF Board

 

Available on back-order

Category:

The Sundance SMT835-ZU47DR-2 is a PCI express ZynqRF system comprised of the TEB0835 carrier board and the TE0835-02-TXE21-A RFSoC module.

Block Diagram

 

TEB0835

The TEB0835 is a carrier for Trenz Electronic’s TE0835 module which is based on Xilinx UltraScale+ RFSoC. It is equipped with a microSD card reader, microUSB2.0, 21x UMCC connectors and six SMD connectors for clocks and ADC/DAC inputs/outputs, six green user LEDs, reset push button, DIP switch for mode, battery holder, FT2232H FTDI, programmable clock generators and a temperature sensor IC. The carrier provides PCIe connector as well.

RAM/Storage

  • 4 Kb EEPROM

On Board

  • Programmable clock generator
  • I2C switch IC
  • 6 x user green LEDs
  • 16 x RF transformation
  • Reset push button
  • Temperature sensor
  • FT2232H FTDI
  • SDIO port expander
  • 2 x DIP switch
  • Pin headers
  • PCIe 6 connector

Power

  • 12V input supply voltage

Interface

  • 21 x UMCC connectors
  • 6 x SMA connectors
  • 2 x Micro USB2.0
  • RJ45 LAN socket
  • Micro SD card socket
  • 2 x UEC5 connectors
  • 2 x UCC8 connectors
  • PCIe x8 card
  • 2 x Samtec Razor Beam SS5 (2 x 80 pol) Board to Board connectors

Dimension

  • 10.66 x 16.76 cm

TE0835-ZU47DR-2

The Trenz Electronic TE0835-ZU47DR-2 is an extended-grade module based on Xilinx Zynq UltraScale+ RFSoC. The module is equipped with 4 x 1 GByte DDR4 SDRAM memory, 2 x 64 MByte SPI Flash memory, USB2.0, Ethernet transceiver and 2 x Samtec Razor Beam Board to Board (B2B) connectors. The system controller CPLD is provided by Lattice MachXO2.

The Zynq UltraScale+ RFSoC family integrates key subsystems for multiband, multi-mode cellular radios and cable infrastructure (DOCSIS) into an SoC platform that contains a feature-rich 64-bitquad-core Arm Cortex-A53 and dual-core Arm Cortex-R5 based processing system.

All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • Xilinx Zynq UltraScale+ XCZU47DR-1FFVE1156E Gen3
  • FPGA Package: E1156 (35 x 35 mm)
  • Available devices
    • ZU25, ZU27, ZU28 (Gen1)
    • ZU42, ZU43, ZU47, ZU48 (Gen3)
  • Speed grade: -1 (slowest)
  • Engine: Quad-core Arm Cortex-A53 MPCore up to 1.3GHz
  • 8 x 14-bit RF-ADCs with 5 GSPS
  • 8 x 14-bit RF-DACs with 9.85 GSPS
  • 2 x PCIe Gen3 x 16 / Gen4 x 8 / CCIX
  • RAM/Storage: 4 x 1 GByte (8 Gbit) DDR4 SDRAM
  • 2 x 64 MByte (2 x 512 Mbit) SPI Flash
  • 2k I2C MAC EEPROM
  • Total I/O: 40 IOs, 20 LVDS, 32 MIO
  • On Board: Lattice MachXO2 CPLD
  • Programmable ultra-high-performance DSPLL
  • USB2.0 OTG transceiver
  • Gigabit Ethernet transceiver
  • 16 x GTY
  • 4 x GTR
  • 3 x oscillators
  • 4 x user LEDs
  • Interface: 2 x Samtec Razor Beam ST5 (2 x 80 pol) Board to Board connectors
  • Power: 5V +/- 10 % Input Supply Voltage
  • Dimension: 65 x 90 mm

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