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MPSoC Module with AMD Zynq™ UltraScale+™ ZU7EV-1E, 4 GByte DDR4, 5.2 x 7.6 cm


111 in stock


The Trenz Electronic TE0807-03-7DE21-AZ is a powerful MPSoC module integrating an AMD/Xilinx Zynq™ UltraScale+™ ZU7EV, 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, 20 x high-speed serial transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O’s is provided via rugged high-speed stacking connections.

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

Please note: this module is identical to variant TE0807-03-7DE21-A, except that different DC/DCs are assembled.

All parts are at least an extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer’s design and cooling solution. Please contact us for options.


  • AMD/Xilinx Zynq™ UltraScale+™ XCZU7EV-1FBVB900E
  • ZU7EV 900 Pin Packages
  • 3 mm mounting holes for skyline heat spreader
  • Size: 52 x 76 mm
  • B2B Connectors: 4 x 160 pin
  • Rugged for shock and high vibration
  • 4 GByte DDR4 SDRAM
  • 128 MByte SPI Boot Flash (dual parallel)
  • User I/Os
    • 65 x PS MIOs, 48 x PL HD GPIOs, 156 x PL HP GIPIOs (3 banks)
    • Serial transceivers: 4 x PS-GTR, 16 x PL-GTH
    • Transceiver clocks inputs and outputs
    • PLL clock generator inputs and outputs
  • Graphic Processing Unit (GPU) + Video codec unit (VCU)
  • Si5345 – 10 output PLL
  • All power supplies on board, single 3.3V Power required
    • 14 on-board DC/DC regulators and 13 LDOs
    • LP, FP, PL separately controlled power domains
  • Support for all boot modes (except NAND)
  • Support for any combination of PS connected peripherals
  • Evenly spread supply pins for good signal integrity

Other assembly options for cost or performance optimization, plus high volume prices, are available on request.

Block Diagram