TE0860-01-4AI61QA

Description

Key Features

SoC

• AMD Zynq UltraScale+
• Device: ZU4 / ZU5 / ZU7
• Engine: CG / EG / EV
• Speedgrade: -1 / -2 / -3
• Temperature Range: Extended / Industrial
• Package: FBVB900

Memory

• Up to 8 GByte 72-Bit DDR4 SDRAM with ECC (PS domain)
• Up to 2 GByte 32-Bit DDR4 SDRAM (PL domain)
• Up to 512 MByte QSPI Boot Flash (dual parallel)
• Up to 64 GByte eMMC (Boot possible)
• 2 x 2 KBit I2C EEPROM with EUI-48 node identity

ON-Board periphery

• 2 x Gigabit Ethernet PHY transceiver
• Hi-Speed USB 2.0 ULPI transceiver with full OTG support
• Built-in TPM 2.0 (Trusted Platform Module) protection
• RFID module (optional)

Interface via 2 x Samtec ADM6 240 pin B2B connector

• Multigigabit interface
  • Transceivers:
    • 4 x GTR
    • 16 x GTH
  • Clocks
    • 4 x GTR
    • 8 x GTH
• User available IOs:
  • Processing Side
    • 12 x MIO
    • I2C MIO
  • Programmable Logic:
    • HP Banks: 52 SE / 24 DIFF
    • HD Banks: 48 SE / 24 DIFF
• Interfaces
  • 2 x Ethernet
  • USB 2.0
• Configuration:
  • JTAG
  • Boot mode selection

Power

• All power supplies are on board.
• Single 5 V … 12 V power input
• 1.8 V and 3.3 V power outputs are available on B2B connector

Dimension

• 55 mm x 74 mm