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AMD Versal™ AI Edge Evalboard with VE2302 device




Available on back-order


The Trenz Electronic TE0950-03-EGBE21A is a powerful adaptive SoC evaluation board, equipped with an AMD Versal™ AI Edge VE2302 device (engineering sample). Furthermore, the board is equipped with 8 GByte DDR4 SDRAM and 128 MByte SPI Flash for configuration and data storage as well as powerful switching power supplies for all required voltages. A large number of inputs and outputs are provided by robust, flexible and cost-effective high-speed connectors. Possible functional limitations and constraints in Vitis.


All parts are at least commercial temperature range of 0°C to +70°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.


  •  SoC
    • AMD Versal™ AI Edge XCVE2302-1LSESFVA784 device (engineering sample)
      • A784 package (pin compatible VE2002, VE2102, VE2202, VE2302, VM1102)
  • RAM/Storage
    • 8 GByte DDR4 SDRAM
    • 128 MByte SPI Flash (primary boot option)
    • MicroSD card (primary boot option)
    • 32 GByte e.MMC (secondary boot option)
    • EEPROM with MAC-address
  • On Board
    • AMD Artix™ 7 FPGA as configurable Levelshifter/MUX for FMC and other 3.3 V IOs
      • 32 MByte SPI Flash
      • 1 dip switch
      • 2 LEDs
    • USB 2.0 Host/Device/OTG (type Micro A/B connector)
    • USB JTAG + UART Micro-USB B
    • Gigabit Ethernet RJ45
    • Output
      • 2 LEDs (1 x MIO, 1 x PL)
    • Input
      • 1 push button (PL)
      • 2 dip switches (MIO)
      • Reset button
  • Interface
    • zQSFP with 4 GTYP Transceiver
    • 2 x CRUVI HS (each optimized for 4 Lane MIPI, one with reduced pinout)
    • 2 x CRUVI LS
    • CSI-2 connector (camera, 2 lane MIPI)
    • FMC
      • 4 GTYP Transceiver
      • 34 LA diff pairs to Levelshifter/MUX
  • Power
    • 12 V plug for 2.1mm Power Jack
      (Without power supply. Suitable accessories are linked at the end of this product page).
  • Dimension
    • 150 mm x 120 mm

Block Diagram