VNX+ to 3U VPX adapter

Adapts between a VNX+ 19 mm, 400‑pin SBCIO PIM (Plug‑In Module) and a SOSA‑aligned OpenVPX Payload Slot

 

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Description

 

This board serves as a precision‑engineered interposer and mechanical adapter between a VNX+ 19 mm, 400‑pin SBCIO PIM (Plug‑In Module) and a SOSA‑aligned OpenVPX Payload Slot conforming to profile MOD3‑PAY‑1F1F2U1TU1T1U1T‑16.2.15‑1.

Designed to simplify system integration, the adapter enables seamless insertion of a VNX+ module into a compatible VPX backplane slot without requiring any redesign of the host system. It preserves full signal mapping between the VNX+ PIM connector and the corresponding VPX interfaces defined by the SOSA Technical Standard.

This is a fully passive interposer, containing no active components, power regulation, or signal conditioning. Its purpose is purely mechanical and electrical adaptation, ensuring:

  • Correct connector alignment and form‑factor translation
  • Direct pass‑through of signals between VNX+ and VPX interfaces
  • Mechanical stability for ruggedised or embedded deployments
  • Compliance with SOSA and VNX+ mechanical envelope requirements

This adapter is ideal for developers and system integrators who need to evaluate, prototype, or deploy VNX+ processing modules within existing VPX‑based architectures, particularly in defense, aerospace, and high‑reliability embedded systems.

 

Features

 

  • Interfaces VNX+ modules to VPX
  • VNX+ module will fit within VPX chassis envelope.
  • SOSA compatible PIC connectors: MOD3-PAY-1F1F2U1TU1T1U1T-16.2.15-1 profile like.
  • VNX+ 19 mm 400 pin SBCIO carrier connector to accept 19mm PIM.
  • Most connections are 1 to 1.
  • Control plane of OVPX CPtp connected to Ethernet port lanes of VNX+;
  • S2 Overlay Mezz I/O pins of VNX+ will be routed to XMC – total 21 pairs;
  • S2 Video plane will be routed to Video plane of Open VPX;
  • USB 3.0 port and USB 2.0 port 2 will be routed;
  • SATA port 1 will be routed;
  • Power LEDs – for 12V, 5V, 3.3V power rails indications;
  • Temperature range is 0°C to +70°C for extended temp and -40 to 85 for industrial grade.

 

Applications

 

  • Rapid firmware/hardware development and testing
  • High-performance data acquisition and signal processing
  • Multi-chassis system integration

 

Block Diagram

 

 

Placement Diagram