CPU Modules – COM-HPC

TE0830

MPSoC Module with AMD Zynq UltraScale+ ZU11EG-1I, COM HPC Standard, 12 x 12cm

 

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SK518-SDHSE

COM-HPC Server Size (D/E) Carrier Board with PCIe/104, Slim-SAS Expansions Extreme Temperature -40°C to 85°C

  • COM-HPC Server (D/E) Support Ampere Altra/Intel Ice-Lake HCC
  • Intel Ice Lake Xeon D-2796TE, D-2775TE, D-2752TER
  • PCIe/104 Express Expansion Slot for Rugged StackPC
  • Multi-Expansion Slots :
    • 4x Slim-SAS(Vertical/Horizontal)
    • 1x mPCIe(Full Size)
    • 2x M.2 2280 M-Key(PCIe Gen4 x 4)
  • I/O : 2x GbE, 4x 10GbE, 1x VGA, 2x SATAIII, 2x COM(RS232), 4x USB3.0, 2x USB2.0
  • 12V DC Input
  • Dimension : 350 mm x 210 mm
  • Extreme Temperature -40°C to 85°C

 SK518 Datasheet

 

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