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TE0830
MPSoC Module with AMD Zynq UltraScale+ ZU11EG-1I, COM HPC Standard, 12 x 12cm
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SK518-SDHSE
COM-HPC Server Size (D/E) Carrier Board with PCIe/104, Slim-SAS Expansions Extreme Temperature -40°C to 85°C
- COM-HPC Server (D/E) Support Ampere Altra/Intel Ice-Lake HCC
- Intel Ice Lake Xeon D-2796TE, D-2775TE, D-2752TER
- PCIe/104 Express Expansion Slot for Rugged StackPC
- Multi-Expansion Slots :
- 4x Slim-SAS(Vertical/Horizontal)
- 1x mPCIe(Full Size)
- 2x M.2 2280 M-Key(PCIe Gen4 x 4)
- I/O : 2x GbE, 4x 10GbE, 1x VGA, 2x SATAIII, 2x COM(RS232), 4x USB3.0, 2x USB2.0
- 12V DC Input
- Dimension : 350 mm x 210 mm
- Extreme Temperature -40°C to 85°C
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