|
System
|
| CPU |
Intel® Xeon® E-2276ME, 45W Coffee Lake 9th Gen, 6C , Freq. 2.8 /4.5 GHz, 12MB cache
Intel® Xeon® E-2276ML, 25W Coffee Lake 9th Gen, 6C , Freq. 2.0 / 4.2 GHz, 12MB cache |
| Memory type |
4 x 260 Pin DDR4 2400MHz SO-DIMM (up to 128GB, XEON®SKU support ECC) |
| CHIPSET |
CM246 |
| GPU |
NVIDIA RTX™ A1000/A2000 embedded graphics
– Standard MXM 3.1 Type A (82 x 70 mm)
– 2048/2560 CUDA® cores, 16 RT Cores, and 64 Tensor Cores
– 6.66TFLOPS peak FP32 performance
– 4GB/8GB GDDR6 memory, 128-bit |
| On board Storage |
NVMe 3.0 512GB.(MB/sec, Max.) 3,400/3,200 MB |
| Expansion Slot |
1 x M.2(M-key,Type: 2280 , SATA/PCIe 3.0 x 4 NVMe)
2 x Mini PCIe Full size (USB / PCIe and 1 x micro SIM Card)
1 x PCIe/104, 1 x FPE |
| TPM |
TPM 2.0 (SLB9665) |
| VIDEO INPUT |
4 Channel capture module for 4 x SMA male connectors >(optional) |
|
Storage
|
| SATA |
1x 2.5” SSD, Up to 4x SSD for Data recorder |
| M.2 |
1x 2280 M key (SATA only) |
|
Front I/O
|
| DC-in |
1x DC-in , with D38999 connector |
| X1 |
1x DVI , with D38999 connector |
| X2 |
1x DVI , with D38999 connector |
| X3 |
2x GLAN + 3 x USB 2.0, with D38999 connector |
| X4 |
4x RS232/422/485 + 4 BIT DIO, with D38999 connector |
| LED |
1x SSD/HDD LED indicator |
| switch |
1x IP65 power button , with LED indicator |
|
Power
|
| Power input |
MIL-STD -461 18V~36V DC-Input |
|
Application, Operating System
|
| Application |
Military Platforms Requiring Compliance to MIL-STD-810 Where Harsh Temperature, Shock, Vibration, Altitude, Dust and MIL-461 EMI Conditions. |
| Operating System |
Windows® 10 64-bit / Linux (support by request) |
|
Physical
|
| Dimension |
250(W) x 325 (L) x 100 (H)mm, (L=395mm for Data recorder, Options) |
| Weight |
10.5 Kg |
| Chassis |
Aluminum Alloy |
| Heatsink |
Heatsink Aluminum Alloy, Corrosion Resistant |
|
Environmental
|
| Green Product |
RoHS, WEEE compliance |
| Operating Temp. |
-40°C to +60°C |
| Storage Temp. |
-40°C to +85°C |
| Relative Humidity |
5% to 95%, non-condensing |
| MIL-STD-810 |
Method 507.5, Procedure II ( Temperature & Humidity )
Method 516.6 Shock-Procedure V Non-Operating ( Mechanical Shock )
Method 516.6 Shock-Procedure I Operating ( Mechanical Shock )
Method 514.6 Vibration Category 24/Non-Operating ( Category 20 & 24, Vibration )
Method 514.6 Vibration Category 20/Operating ( Category 20 & 24, Vibration )
Method 501.5, Procedure I ( Storage/High Temperature )
Method 501.5, Procedure II ( Operation/High Temperature )
Method 502.5, Procedure I ( Storage/Low Temperature )
Method 502.5, Procedure II ( Operation/Low Temperature )
Method 503.5, Procedure I ( Temperature shock ) |
| Reliability |
No Moving Parts; Passive Cooling.
Designed & Manufactured using ISO 9001 / 2000 Certified Quality Program. |
| MIL-STD-461 |
CE102 : 10 KHz – 10 MHz
RE102-4 : 1.5 MHz -30 MHz – 5 GHz
RS103 : 200 MHz – 3.0 GHz – 5.0 GHz, 50 V/m equal for all frequencies |
|
| Designed to Meet Items ( Options ) |
| CS101, CS114, CS115, CS116 |
| CE106, RE103, RS101 |
|
| MIL-STD-1275 |
Steady State |
20V-33V |
|
Surge Low |
18V/500ms |
|
Surge High |
100V/500ms |
