EMC²-ZU2CG

£1,395.00

 

This system comprises an EMC²-DP and a Trenz Electronic SoM, namely the TE0820-05-2AI21MA

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Description

 

EMC²-DP

The EMC²-DP is a PCIe/104 OneBank™ Carrier for a Trenz compatible SoC Module and has expansion for a VITA57.1 FMC™ LPC I/O board  and also has I/O pins, using a 100-way Samtec RazorBeam connectors system. The add-on board, called “Sundance External Interface Connector – SEIC”  contains LEDs, RS232, USB2.0, HDMI, 1Gb Ethernet and SATA . The “SEIC” can be customised for individual applications and bespoke connectors.

The PCIe/104 OneBank™ design enables the EMC²-DP to be added to robust and rugged installations for various commercial, medial, industrial and military uses.

  • PCIe/104 OneBank Carrier for Trenz SoC Modules
  • PCI Express Gen 2 compatible and integrate PCI Express switch
  • Infinite number of EMC²-DP can be stacked for large I/O solutions
  • Expandable with any VITA57.1 FMC I/O Module for more flexibility
  • 96mm x 90 mm PC/104 Form-Factor with Cable-less Break-Out PCB Connector

 

TE0820-05-2AI21MA

The Trenz Electronic TE0820-05-2AI21MA is an industrial-grade MPSoC module integrating a Xilinx Zynq UltraScale+ ZU2CG, 2 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O’s is provided via rugged high-speed stacking connections.

All this on a tiny footprint, smaller than a credit card, at the most competitive price. Modules in 4 x 5 cm form factor are fully mechanically and largely electrically compatible among each other.

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution.

  • Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784I
  • ZU2CG, 784 Pin Packages
    • Application Processor: Dual-core ARM Cortex-A53 MPCore
    • Real-Time Processor: Dual-core ARM Cortex-R5 MPCore
    • Four high-speed serial I/O (HSSIO) interfaces supporting following protocols:
      • PCI Express interface version 2.1 compliant
      • SATA 3.1 specification compliant interface
      • DisplayPort source-only interface with video resolution up to 4k x 2k
      • USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
      • 1 GB/s serial GMII interface
    • 132 x HP PL I/Os (3 banks)
    • 14 x PS MIOs (6 of the MIOs intended for SD card interface in default configuration)
    • 4 x serial PS GTR transceivers
  • Rugged for shock and high vibration
  • Plug-on module with 2 x 100-pin and 1 x 60-pin Razor Beam High-Speed hermaphroditic Terminal/Socket Strips (regular 4 mm)
  • 2 GByte DDR4 SDRAM, 32-Bit databus-width
  • 128 MByte QSPI boot Flash in dual parallel mode
  • 8 GByte e.MMC Memory (up to 64 GByte)
  • Programmable quad PLL clock generator PLL for PS GTR clocks (optional external reference)
  • Gigabit Ethernet transceiver PHY
  • MAC address serial EEPROM with EUI-48 node identity
  • Hi-speed USB2 ULPI transceiver with full OTG support
  • All power supplies on board
  • Evenly spread supply pins for good signal integrity
  • 4 x 5 cm form factor

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