V3UFMC02P

V3UFMC02P

AMD UltraScale+ FMC+ Carrier

Rugged mid-range FPGA processing for cost-sensitive defence, aerospace and industrial programs

 

  • 3U VPX FPGA FMC Carrier aligned with the SOSA Technical Standard
  • AMD UltraScale+™ FPGA processor
  • Data & expansion planes for high-speed protocols
  • Wide range of OpenVPX slot profiles
  • Up to 8GB DDR4 ECC memory
  • Air or conduction-cooled
  • Designed and made in the Netherlands
  • VITA 57.4 FMC+ mezzanine site for I/O card
  • Long-term Availability and Security Assured

 

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Description

Derived from the UltraScale XU01P Series, the Kintex UltraScale+ powered 3U V3UFMC02P is a member of Hybrid DSP’s XU02P 1156 Core Series of mid-range, cost-effective, rugged processing boards based on the AMD Kintex UltraScale+ A1156 FPGA package, up to 8GB DDR4 and an ARM-based Board Management Controller (BMC).

The V3UFMC02P is available with a range of build options for OpenVPX air and conduction-cooled-based systems as well as those aligned with the SOSA Technical Standard. Features include an FMC+ site to support mezzanine cards with I/O routing to either the front panel or optionally VITA 66/67 optical/coax blind mate connectors on the backplane.

In addition to numerous standard build options, the design is optimized for rapid customization of many key features, including the front panel, cooling solution, reference firmware, and BMC. Furthermore, the PCB layout and stack-up allows for a viable low-risk route for more complex technical and commercial requirements, including modular-to-monolithic.

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