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V3UFMC02P

AMD UltraScale+ FMC+ Carrier

Rugged mid-range FPGA processing for cost-sensitive defence, aerospace and industrial programs

 

  • 3U VPX FPGA FMC Carrier aligned with the SOSA Technical Standard
  • AMD UltraScale+™ FPGA processor
  • Data & expansion planes for high-speed protocols
  • Wide range of OpenVPX slot profiles
  • Up to 8GB DDR4 ECC memory
  • Air or conduction-cooled
  • Designed and made in the Netherlands
  • VITA 57.4 FMC+ mezzanine site for I/O card
  • Long-term Availability and Security Assured

 

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Description

Derived from the UltraScale XU01P Series, the Kintex UltraScale+ powered 3U V3UFMC02P is a member of Hybrid DSP’s XU02P 1156 Core Series of mid-range, cost-effective, rugged processing boards based on the AMD Kintex UltraScale+ A1156 FPGA package, up to 8GB DDR4 and an ARM-based Board Management Controller (BMC).

The V3UFMC02P is available with a range of build options for OpenVPX air and conduction-cooled-based systems as well as those aligned with the SOSA Technical Standard. Features include an FMC+ site to support mezzanine cards with I/O routing to either the front panel or optionally VITA 66/67 optical/coax blind mate connectors on the backplane.

In addition to numerous standard build options, the design is optimized for rapid customization of many key features, including the front panel, cooling solution, reference firmware, and BMC. Furthermore, the PCB layout and stack-up allows for a viable low-risk route for more complex technical and commercial requirements, including modular-to-monolithic.

Specifications

 

Main Processor and Memory

  • AMD Kintex UltraScale+TM A1156 FPGA XCKU11P, XCKU15P
  • DDR4 4GB or 8GB with ECC

 

Board Management

  • Voltage and temperature monitor
  • Power/reset control
  • Tier-2 VITA 46.11 IPMI

 

Backplane Architecture (3U)

  • Up to 16 serial transceiver lanes on VPX P1 (PCIe Gen3, Aurora, Ethernet, RapidIO etc)
  • Up to 35 LVDS on VPX P2
  • VITA 65.0 and SOSA aligned slot profiles
  • VITA 66/67 Optical and Coaxial options

 

Front Panel I/O

  • FMC+ site per VITA 57.4
  • Extended component-free region

 

Mechanical

  • 3U VPX COTS and Custom air and conduction-cooled (FMC+) compatible heat frame
  • OpenVPX and VPX-REDI
  • Pitch: 1” and 0.8”

 

Board Support Package

  • Vivado project, VHDL-based reference designs, UART and PCIe drivers, API, Python and C/C++ sample applications

 

Compliance

  • OpenVPX System Specification encompasses VITA 46.0, 46.3, 46.4, 46.6, 46.7, 46.9, 46.11
  • Compatible with VITA 65 and SOSA-aligned systems
  • VITA 47.0
  • VITA 48.0/48.1/48.2 (REDI)
  • VITA 57.4

 

VITA 47.0 Construction, Safety and Quality

  • Environmental Class: EAC1, EAC6, ECC1 and ECC3 (-40 C to +70 C operating temperature range)
  • IPC-A-610D Class 3 and IPC A 600G Class 3
  • Conformal Coating: IPC-CC-830B

Block Diagram

 

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