System
|
CPU |
Intel® 11 Gen. Tiger Lake-H Processors, up to 8 cores, integrated Intel® UHD Graphics
Intel® Xeon® W-11865MRE, 45W Tiger Lake 11th Gen, 8C, Freq. 2.6/4.7 GHz, 24MB cache |
Memory type |
Up to 96GB DDR4 SO-DIMM, non-ECC and ECC |
CHIPSET |
Intel® RM590E (support ECC, with Xeon CPU) /QM580E |
GPU |
NVIDIA RTX™ A4500 GA104-955 GPU
8GB/16GB GDDR6 memory, 5888 CUDA cores |
On Board Storage |
Soldered 64 GB NVMe |
Expansion Slot |
2x Full-size mini PCIe (1 with mSATA supported)
-1 with mSATA/USB2.0/PCIeX1 support
-1 with SIM/USB2.0/PCIeX1 support
1x 2280 M key (SATA only) |
Storage
|
SATA |
2x 2.5” SSD, Hot Swappable SSD/HDD slot |
M.2 |
1x 2280 M key (SATA only) |
Front I/O
|
X1 |
2x GbE LAN + 2x USB2.0 + 1x COM(RS232) with D38999 connector |
X2 |
1x VGA + 4x DI/4x DO + 3x RS422 with D38999 connector |
X3 |
1x USB3.0 , with D38999 connector |
X4 |
1x USB3.0 , with D38999 connector |
X5 |
1x DC-in , with D38999 connector |
LED |
1x SSD/HDD LED indicator |
switch |
1x IP65 power button , with LED indicator |
SSD |
2x 2.5”Easy swap SSD Tray |
Power
|
Power input |
MIL-STD-461 18V~36V DC-Input |
Application, Operating System
|
Application |
Military Platforms Requiring Compliance to MIL-STD-810 Where Harsh Temperature, Shock, Vibration, Altitude, Dust and MIL-461 EMI Conditions. |
Operating System |
Windows® 10 64-bit / Linux (support by request) |
Physical
|
Dimension |
250(L) x 325 (W) x 100 (H)mm |
Weight |
11 KG |
Chassis |
Aluminum Alloy |
Heatsink |
Heatsink Aluminum Alloy, Corrosion Resistant |
Environmental
|
Green Product |
RoHS, WEEE compliance |
Operating Temp. |
-20°C to +60°C |
Storage Temp. |
-40°C to +85°C |
Relative Humidity |
5% to 95%, non-condensing |
MIL-STD-810 |
Method 507.5, Procedure II ( Temperature & Humidity )
Method 516.6 Shock-Procedure V Non-Operating ( Mechanical Shock )
Method 516.6 Shock-Procedure I Operating ( Mechanical Shock )
Method 514.6 Vibration Category 24/Non-Operating ( Category 20 & 24, Vibration )
Method 514.6 Vibration Category 20/Operating ( Category 20 & 24, Vibration )
Method 501.5, Procedure I ( Storage/High Temperature )
Method 501.5, Procedure II ( Operation/High Temperature )
Method 502.5, Procedure I ( Storage/Low Temperature )
Method 502.5, Procedure II ( Operation/Low Temperature )
Method 503.5, Procedure I ( Temperature shock ) |
Reliability |
No Moving Parts; Passive Cooling.
Designed & Manufactured using ISO 9001 / 2000 Certified Quality Program. |
MIL-STD-461 |
CE102 : 10 KHz – 10 MHz
RE102-4 : 1.5 MHz -30 MHz – 5 GHz
RS103 : 200 MHz – 3.0 GHz – 5.0 GHz, 50 V/m equal for all frequencies |
Designed to Meet Items ( Options ) |
CS101, CS114, CS115, CS116 |
CE106, RE103, RS101 |
|
MIL-STD-1275 |
Steady State |
20V-33V |
|
Surge Low |
18V/500ms |
|
Surge High |
100V/500ms |