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CPT330B-8C8P-G1660S

Intel® Coffee Lake-R 9th Xeon/Core i , Autonomous Driving GPU-Computer, 8x Gigabit PoE, 8x CAN BUS, 4x LAN, 2 x 2.5” SSD, 9V to 48V DC-IN, Nvidia GTX1660S/RTX3070 Graphics Card supported

  • Intel® Coffee Lake-R 8/9th Xeon/Core i Processor
  • Nvidia GTX1660S Graphics Card supported(RTX3070 Optional)
  • DDR4-2666 SO-DIMM up to 64G (Xeon SKU support ECC)
  • Rich I/O support multiple sensors: Lidar, Radar, Camera
  • 6x USB3.0, 2x USB2.0, 12x LAN(include 8x POE) , 8x CANBUS, 1x PS/2, 1x Mic-in/Line-out
  • Hot SWAP 2.5” SSD Tray
  • Multi Display: HDMI/DVI-I/DP
  • System Power Wide Range DC-IN 9V~48V
  • GPU Power DC-IN 12V
  • Operating Temperature -20°C to 60°C
  • Optional Expansion: Frame Grabber PCIe Card

 

 CPT330B Datasheet

 CPT330B User Manual

 

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Description

Redesign Long-haul Trucking Logistic
Long-haul trucking continues to play a major role in today’s supply chains. There are plenty of challenges that the trucking logistics are facing now. The most important issue is making the long-haul trucking sustainability. Due to the size and weight of most long-haul trucks, mean this sector is likely to decarbonize slower than most others. In order to improving the efficiency and traffic safety while realizing the sustainability, the fleet management becomes a popular discussion in recent years.

How Autonomous Vehicle Works
Sensors are key components to make a vehicle driverless. Camera, radar, ultrasonic and LiDAR enable an autonomous vehicle to visualize its surroundings and detect objects. Cars today are fitted with a growing number of environmental sensors that perform a multitude of tasks. The control system integrated sensors for AV encompasses three parts: perception, decision and execution.

01. PERCEPTION LAYER
Perception enables sensors to not only detect objects, but also acquire and eventually classify and track objects surround.

02. DECISION LAYER
Decision-taking is one of the most challenging tasks that AVs must perform. It encompasses prediction, path planning, and obstacle avoidance. All of them performed on the basis of previous perceptions.

03.EXECUTION LAYER
Execution layer consists of interconnection between accelerator, brakes, gearbox and so forth. Driven by Real-Time Operating System (RTOS), all these devices can carry out commands issued by Driving Computer.

 

Required High Performance Computing Power

7StarLake GPGPU Series
An automated-driving control unit is the core controller of autonomous vehicles. 7Starlake has designed high performance GPGPU computer to EASYMILE to achieve the most advanced driverless shuttle – EZ10 . EZ10 has been launched in 2015 and operated over 26 countries and up to 200 sites, including Asia, Middle East , North America and Europe. EZ10 has no steering wheel, gas pedal or brake pedal, being 100% driverless. Relative to normal cars, hardware accelerators, such as GPUs , CPU and FPGAs are extremely important to autonomous vehicles for handling computation-intensive tasks.

High Performance NVIDIA Graphic card
Nvidia designs powerful graphics processing units (GPUs)for gaming and highly professional market for transportation, energy, medical analyse, and public sector. Nowadays, Nvidia has diversified its business focusing on four markets: Gaming, professional visualization, data canter, and artificial intelligence. When it mentioned to typically generation developed by NVDIA, series of GeForce ,RTX graphics cards and computer systems are powered by NVIDIA Turing™.

Turing is the code name for a graphics processing unit (GPU) microarchitecture developed by Nvidia. Featuring concurrent execution of floating point and integer operations, adaptive shading technology, Turing shaders enable awesome performance increases on better performance. Get more power efficiency over previous generation for a faster, cooler and quieter gaming experience that take advantage of Turing’s advanced graphics features.

 

Expansion Module

I. Ethernet Expansion Module
Option 1: 4 x Gigabit Ethernet (RJ45)
Option 2: 2 x Gigabit Ethernet (RJ45)
Option 3: 8 x Gigabit PoE (RJ45)
Option 4: 4 x Gigabit PoE (RJ45)

II. COM Expansion Module
2 x RS232/422/485 with isolated DIDO (4 x DI, 4 x DO)
8 x CANBUS

Specifications

System

CPU 8/9th Gen Intel® Coffee Lake-R Core i9/i7/i5/i3 LGA1151 Socket Processor, 6 core TDP Max.65W
Chipset Intel® C246
Memory type DDR4 – 2666MHz SO-DIMM up to 64G(Xeon SKU support ECC)
Storage Device 2x 2.5″ SATAIII HDD/SSD SWAP Tray

Display

 
Graphics Card NVIDIA GTX1660S supported

Rear I/O

 
COM 2x RS232/422/485
Ethernet 4x RJ45(Optional : 2x RJ45)
USB 4x USB3.0 + 2x USB2.0
PS/2 1x
Display Play 1x
DVI-I 1x
Terminal 1x 2Pin Terminal Block Remote Power ON/OFF

1x 2Pin Terminal Block Remote Reset

1x 4Pin Terminal Block External FAN Connector

AUDIO 1x Mic-in, 1x Line-out
SSD Tray 2x
GPU External Display 1x GPU GTX1660S (3x DP + 1x HDMI)
Expansion PCIe Slot Optional 1 :  GPU RTX3070(3x DP + 1x HDMI)

Optional 2  : Frame Grabber Card

GPU External Power 12V DC-IN
System Power 9V~48V DC-IN

Front I/O

Power Button 1x (with LED indicator)
PWR LED 1x
HDD LED 1x
DIO LED 1x
ACT LED 2x
SPEED LED 2x
HDMI 1x
CANBUS 8x
POE 8x

Power Requirement

 
GPU Power Input 12V DC-IN
System Power Input 9V~48V DC-IN

Applications, Operating System

Operating System Windows 10 64Bit

Ubuntu20.04

Physical

 
Dimension (WxDxH) 250 x 150 x 264.2 mm
Operating Temperature -20°C to 60°C
Storage Temperature -40°C to +85°C
Relative Humidity 5% to 95%, non-condensing

CPU

Intel® Core™ i7-9700TE Processor (up to 3.8 GHz, 8 cores)

Thermal Point Testing Temp.
-40°C
-20°C
0°C
+25°C
+50°C
+55°C
+60°C

CPU T-J

0

17

16

58

68

75

91

CPU Die

-10.4

8.8

11.8

38.6

71.9

76

81.5

CPU Heat sink

-13.8

4.7

8.2

34.7

67.8

72

77.3

Δ1=(TJ-Die)

10.4

8.2

4.7

5.0

5.0

7.0

7.0

Δ2=(Die-Heat Sink)

3.4

4.1

4.7

5.0

5.0

6.0

5.0

CPU Frequency (GHz)

3.15

3.02

2.66

2.68

2.57

2.45

2.41

GPU T-J

19

57

71

82

88

GPU Die

31.5

62.6

85.5

87

89.3

GPU Frequency (GHz)

1.5

0.84

0.675

1.125

0.96

Intel® Core™ i7-8700T Processor (up to 2.4 GHz, 6 cores)

Thermal Point Testing Temp.
-40°C
-20°C
0°C
+25°C
+50°C
+55°C
+60°C
CPU T-J 0 20 16 77 95 99 100
CPU Die -10 8.2 11.8 38.6 71.9 76 81.5
CPU Heat sink -15.7 2.2 8.2 34.7 67.8 72 77.3
Δ1=(TJ-Die) 10 11.8 4.7 5.0 5.0 7.0 7.0
Δ2=(Die-Heat Sink) 5.7 6 4.7 5.0 5.0 6.0 5.0
CPU Frequency (GHz) 2.83 2.85 2.66 2.97 2.26 2.18 2.19

Intel®i7-8700 Processor( up to 3.2 GHz,6 cores)

Test 50°C with air flow

Description System Top Sink CPU Die CPU T-j CPU Freq
100%CPU Loading
with Graphic

50°C with hot air flow

71.4 68.8 100 3.1 GHz
100%CPU Loading
without Graphic

50°C with hot air flow

70.4 73.2 100 3.2 GHz

Test 60°C with air flow

Description System Top Sink CPU Die CPU T-j CPU Freq
100% CPU Loading
with Graphic

60°C with hot air flow

76.8 81.5 100 2.99 GHz
100% CPU Loading
without Graphic

60°C with hot air flow

75 79.6 100 3.15 GHz

Test 50°C with no air flow

Description System Top Sink CPU Die CPU T-j CPU Freq
100% CPU Loading
with Graphic

50°C without air flow

78 81.1 100 3.05 GHz
100% CPU Loading
without Graphic

50°C without air flow

77 81.1 100 3.06 GHz

Ordering Info

 

Thermal Solution

 

Patented Thermal Solution

7STARLAKE designs a unique enclosure that is able to stack together both horizontally and vertically. The aluminum heat sink enclosure of CPT330B secures top heat dissipation. It’s well-known that fanless method relies heavily on the precise calculation of the efficiency of each heat dissipating component. 7STARLAKE exclusively adopts special heat radiating material and combining with special CNC cutting, further forged into a lavish sophisticated metal. Superior fanless design guarantees silent operation that enhances the flexibility of mobility and prevents the intrusion of dust and debris. Achieving ultimate reliability and stability, CPT330B can operate under extended temperature ranging from -20 to 60°C.

Video

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  CPT330B-8C8P-G1660S_UM_20221018_V3_1 7StarLke_UM_CPT330B-4C4P-G1660S