Description
The new Trenz Electronic TE0861-01 is a powerful MPSoC module with an AMD Zynq™ UltraScale+™. In addition, the module, which measures only 5.5 x 7.4 cm, is equipped with a large DDR4 SDRAM, dual QSPI flash memory for configuration and data storage, 20x high-speed serial transceivers, two Ethernet PHYs, a TPM Module, and powerful switching power supplies for all required voltages. A large number of inputs and outputs are provided via robust high-speed connectors. All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.
Key Features
SoC / FPGA
- AMD Zynq UltraScale+
- Device: ZU6 / ZU9 / ZU15
- Engine: CG / EG
- Speedgrade: -1 / -2 / -3
- Temperature Range: Extended / Industrial
- Package: FFVC900
RAM / Storage
- Up to 8 GByte 72-Bit DDR4 SDRAM with ECC (PS domain)
- Up to 512 MByte QSPI Boot Flash (dual parallel)
- Up to 64 GByte eMMC (Boot possible)
- 2 x 2 KBit I2C EEPROM with EUI-48 node identity
On Board
- 2 x Gigabit Ethernet PHY transceiver
- Hi-Speed USB 2.0 ULPI transceiver with full OTG support
- Built-in TPM 2.0 (Trusted Platform Module) protection
- 3 x Oscillator (for MPSoc, Ethernet, USB)
- RFID module
Interface via 3 x Samtec ADM6 240 pin B2B connector
- Multigigabit interface
- Transceivers:
- 4 x GTR
- 16 x GTH
- Clocks:
- 4 x GTR
- 8 x GTH
- Transceivers:
- User available IOs
- Processing Side:
- 12 x MIO
- I2C MIO
- Programmable Logic:
- HP Banks: 156 SE / 72 DIFF
- HD Banks: 48 SE / 24 DIFF
- Processing Side:
- Interfaces
- 2 x Ethernet
- USB 2.0
- Configuration
- JTAG
- Boot mode selection
Power
- All power supplies are on board
- Single 5 V … 12 V power input
- 1.8 V and 3.3 V power outputs are available on B2B connector
Dimension
- 55 x 74 mm
