Description
The Trenz Electronic TEI0187-02-T4E111A is a powerful System-on-Module, equipped with an Altera® Agilex™ 5E SoC. Furthermore, the board is equipped with 2 GByte DDR4 SDRAM and 256 MByte QSPI Flash for configuration and data storage as well as powerful switching power supplies for all required voltages. A large number of inputs and outputs are provided by robust, flexible and cost-effective high-speed connectors.
All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.
Key Features
FPGA/SoC
- Agilex™ 5 SoC E-Series Device Group B (A5ED065BB32AE4S)
- B32A package (32mm x 32mm, 0.65mm, Variable Pitch FPGA)
- As assembly variant on request possible:
- Package B32A (32×32 mm, 1591 balls) compatible device :
- Device Group A, Specification C,D → A5E 013A, A5E 028A, A5E 043A, A5E 052A, A5E A5E 065A
- Device Group B, Specification A,B,C,D,E → A5E 013B, A5E 028B, A5E 043B, A5E 052B, A5E 065B (default)
- Package B32A (32×32 mm, 1591 balls) compatible device :
RAM/Storage
- 1 x QSPI Flash, 2 Gbit (256 MByte)
- 1 GB LPDDR4 SDRAM (32Bit) for HPS (Expandable up to 4 GB)
- 1 GB LPDDR4 SDRAM (32Bit) for Fabric FPGA (Expandable up to 4 GB)
- 8 GB eMMC (Expandable up to 64 GB)
- 1 x 2 Kbit & 1 x 128 Kbit EEPROMs Memory
IO Resources:
- MGT* : up to 24 x transceivers (up to 28 Gbps)
- HSIO*: up to 96 differential /192 SE
- HVIO*: up to 120 SE
- HPS IO: 19 I/O (SDIO, UART, I2C, I3C, GPIOs)
* depends FPGA assembly variants, IO resources could be changed
On-Board periphery
- Gigabit Ethernet PHY (RGMII)
- USB2.0 PHY (ULPI). Support USB3.1 Gen1 5Gbps (use 1 transceiver)
- TPM2.0
- Clocks for LPDDR4 SDRAM, GigE PHY, USB PHY, SDM FPGA
- SD3.0 (optional)
- B2B connection: Plug-on-module with 3 x 240-pin Samtec AccelerateHD (ADM6) connectors
Power
- 5V (12V) Power supply
Dimension
- 52 mm x 76 mm
