Description
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System |
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|---|---|---|
| CPU | Intel® 9th Gen Core™ i7-9700TE ( Frequency 1.8GHz, Turbo Boost Frequency up to 3.8GHz ), 8 Cores, 12MB SmartCache. | |
| Memory type | 2x DDR4 2666 MHz, 64GB Intel Core i9/i7/i5 CPUs support up to 64GB (32GB per DIMM) Intel Core i3 CPUs support up to 32GB (16GB per DIMM) |
|
| CHIPSET | Intel® Q370 Chipset | |
| GPU | – RTX2060S (CUDA Core: 2176, 8GB GDDR6) (optional)
– NVIDIA® GTX series (optional) |
|
| GRAPHICS | Intel® Gen9 Graphics DX 11 / 12 | |
| Expansion Slot | 1x M.2 (KEY E, 2230) with PCIe x1, CNVi and USB2.0 for Wireless
1x M.2 (KEY M, 2242/2260/2280) with PCIe x4 and SATA3 1x M.2 (KEY M, 2242/2260/2280) with PCIe x4 and SATA3 |
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| BIOS | AMI SPI 128 Mbit | |
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Display |
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| Display | DisplayPort 1.2, DP++ Max resolution up to 4096 x 2304@60Hz |
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Storage |
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| SATA | 2x 2.5” SSD, Hot Swappable SSD/HDD slot | |
| M.2 | 2x M.2 (Key M, 2242 / 2260 / 2280) with PCIe x4 & SATA3 for SSD | |
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Ethernet |
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| Ethernet | 2x Intel® Gigabit Ethernet
LAN1: 1x Intel® I210 with 10/100/1000 Mbps LAN2: 1x Intel® I219LM with 10/100/1000 Mbps, |
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| PoE
(optional) |
Via 1x M.2 (KEY M) to 2x isolated GbE LAN ports
2x independent PSE channels Complies with IEEE 802.3af, up to 15.4W at 48V per PoE port |
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Front I/O |
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| Display Port | 4x DP 1.2 | |
| Ethernet | 2x 1Gigabit LAN | |
| USB | 4x USB3.1 (Gen1) | |
| HDD Tray | 2x 2.5” SSD Tray | |
| COM | 1x RS-232 | |
| Indicator | 1x HDD indicator | |
| On/off | 1x Power Button, w/power on indicator | |
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Rear I/O |
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| Antenna | 4x Antenna Hole | |
| DC-IN | 1x 4-pin DC terminal block (optional for wide voltage) | |
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Power |
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| Power input | 12V (Standard)
12V~36V (optional) (P.S. 18V~36V 300W power adaptor for equipped NVIDIA RTX2060S ) |
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Operating System |
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| OS | Windows® 10 64-bit / Linux (support by request) | |
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Physical |
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| Dimension | 246(L) x 313.5 (W) x 100 (H)mm | |
| Weight | (TBD) | |
| Chassis | SECC | |
| Heatsink | Heatsink Aluminum Alloy, Corrosion Resistant | |
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Environmental |
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| Green Product | RoHS, WEEE compliance | |
| Operating Temp. | -20 to 60°C | |
| Storage Temp. | -40 to 85°C | |
| Relative Humidity | 5% to 95%, non-condensing | |
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MIL-STD-810 Specifications (Operating) |
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| Method 502.5 | Low Temperature | -20°C, 4 hours, ±3°C |
| Procedure 2 | ||
| Method 501.5 | High Temperature | +55°C, 4 hours, ±3°C |
| Procedure 2 | ||
| Method 507.5 | Humidity | 85%-95% RH without condensation,
24 hours/ cycle, conduct 10 cycles. |
| Method 514.6 | Vibration | 5-500Hz, Vertical 2.20Grms, 40mins x 3axis. |
| Method 516.6 | Shock | 20 Grms, 11ms, 3 axes. |
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MIL-STD-810 Specifications (Non-Operating) |
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| Method 502.5 | Low Temperature Storage | -33°C, 4 hours, change rate:≦20°C/ Hour
-15°C, 72hours (By request) |
| Procedure 1 | ||
| Method 501.5 | High Temperature Storage | +71°C, 4 hours, change rate:≦20°C/ Hour
+63°C, 240 hours (By request) |
