SR700

Description

SR700, EBX rugged system is a powerful system driven by Intel® 4th generation Haswell CPU and chipset soldering onboard. Processor i7-4700EQ plus Intel® QM87 chipset supports clock speed 2.4 GHz, up to 3.4 GHz. Quad cores, turbo up to 8 cores to cope with enormous data computing. SR700 highlights on its extreme rugged design, high functionality, and specially installed MIL-STD M12 connectors. Full IP65 protection is guaranteed. What’s even more impressive is the fact that SR700 can withstand vibration up to 10 Grms and shock up to 75G. It supports extended temperature operation from -40 to 70℃. MIL-STD 461 18V~36V DC input design can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself. SR700 is the perfect solution to military purposes, such as defense, marine navigation and aviation technology. It also can withstand and survive in the harshest surroundings. Even in fields like mining and offshore drilling, SR700 can provide equally stunning performance.

The unique design of 7StarLake’s stack rack series integrate both horizontal and vertical placement. Dual-sided aluminum heat sink further secures extreme heat dissipation. 7StarLake incorporates exceptional heat radiating material with exceptional CNC cutting design. Fanless method relies heavily on the precise calculation of the efficiency of each heat dissipating component. Superior fanless design guarantees silent operation that enhances the flexibility of mobility and prevents the intrusion of dust and debris. SR700 supports -40°C up to 70°C extended temperature operation, achieving ultimate reliability and stability.

SR stands for Stack & Rack, which means that our SR series systems are capable of stacking and rack mount cabinet placement. With key components such as CPU, memory, and storage devices all soldered onboard, the possible risk of damages caused by sudden impact of vibration and bumping can be diminished to the minimum. MIL-STD tests are established by the US government to simulate how materials would hold up to harsh environments. SR700 has passed the tests concerning its resistance to extremely high & low temperature, humidity, shock, and vibration. SR700 has complete resistance to dust and water, making it even more ruggedized and reliable. SR700 can stand against the intrusion of dust, accidental contact, and water. Not just commercial grade waterproof and dustproof, it can reach Dust Tight level, which guarantees complete protection against ingression. Even the strong power of water jet won’t post a threat to it, now this is true ruggedness embodied.

Rugged Connectors (M12 & other MIL-STD variations)
Robust and reliable M12 connectors are implemented for SR700. Compact design meets rugged capability, M12 connectors can seal the connector area securely, operation can continue uninterrupted even under the most severe conditions. What makes SR700 stand out from standard commercial grade product is the fact that all the connectors can be customized to U.S. Military standard connectors (D38999 series) from the famous connector manufacturer Amphenol.

• D38999 Series
MIL-DTL-38999 is a high-performance cylindrical connector family designed for cable-to-panel I/O applications in military, aerospace and other demanding hazardous situations. Class D38999 connectors are capable of operation within a temperature range -65 to 200℃. They are lightweight and can stand up to environmental challenges. Made with removable crimp or fixed hermetic solder contacts, these connectors provide high-vibration characteristics and are suitable for severe wind and moisture problem areas.

• VG96912
Derived from MIL-D38999 Series, VG96912 incorporates lightweight, scoop proof and high contact density features. The plug and receptacle bodies are manufactured from aluminum alloy and protected by cadmium or nickel plating.

System main board: EBX SBC-OXY5737A

1. Intel® Core i7 CPU soldering onboard
SR700 is based on EBX SBC—OXY5737A, powered by Intel Ivy Bridge i7-4700EQ quad core processor plus QM87 chipset soldered onboard. With CPU soldering onboard, there is less conduction of heat and high density interconnection between the motherboard and the components, which reduces the MB from the crisis of overheating. The all-in-one design rugged system guarantees CPU full speed operation at 70℃.

2. Wide voltage power input 9V~36V with power delay on/off
Wide voltage power input design (9~36V) can protect the system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself. Power delay on/off design allows selectable boot-up & shutdown voltage for low power protection. SR700 provides 8-level power on/off delay time, status of ignition and low voltage can also be detected.

3. Expandable by Extension Storage Module, the SK401
SR700 features stackable PCIe 104 and FPE expansion slot. Optional module connection can be achieved for a variety of devices. Stacking with the storage module – SK401, 2 x 2.5″ SSD or HDD and 2 x mSATA can be supported. The SK401 suppports Win 7 OS, XP, Linux, and DOS.

Specifications

System

CPU

Intel^® Core™ i7-4700EQ, 47W, Haswell 4th Gen. 4C, Freq. 2.4/3.4 GHz, 6MB cache

Chipset

Intel^® QM87 Chipset (Intel^® DH82QM87 PCH)

Memory Type

1 x DDR3 1600 XR-DIMM up to 8 GB with ECC

Expansion Slot

2 x mPCIe (1 x colay with mSATA) for GEN2

Storage Device

64GB Onboard SSD
1 x mSATA
1 x 2.5″ HDD/SSD
1 x SatckPC Slot

Front I/O

Power Button

Waterproof Power Button with LED backlight

Power Input

1 x DC input (4-pin Rugged M12 connector)

2 x USB2.0 (8-pin Rugged M12 connector)

1 x GbE LAN (8-pin Rugged M12 connector)

1 x VGA (12-pin Rugged M12 connector)

1 x RS232, 1 x RS485 (12-pin Rugged M12 connector)

Application, Operating System

Application

Military Platforms Requiring Compliance to MIL-STD-810 Where Harsh Temperature, Shock, Vibration, Altitude, Dust and MIL-461 EMI Conditions

Operating System

Windows 7 x32/x64、Windows 8 x32/x64、Windows 8.1 x32/x64、Windows 10 x32/x64

Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04、Open SUSE 12.2

Power

Power Input

MIL-STD 461 18V~36V power supply

Physical

Dimension

350 x 230 x 76 mm

Weight

8.6 kg (18.9 lbs)

Chassis

Aluminum Alloy

Environmental

Operating Temp.

-40°C to 70°C(ambient with air flow)

Storage Temp.

-40°C to 85°C

Relative Humidity

5% to 95%, non-condensing

Green Product

RoHS, WEEE compliance

MIL-STD-810

Method 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)

Reliability

No Moving Parts; Passive Cooling.
Designed & Manufactured using ISO 9001 / 2000 Certified Quality Program.

MIL-STD-461

CE102 : 10 KHz – 10 MHz
RE102-4 : 1.5 MHz -30 MHz – 5 GHz
RS103 : 200 MHz – 3.0 GHz – 5.0 GHz, 50 V/m equal for all frequencies

CPU

The SR700 offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers’ extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

Test Configuration

Device	Configuration	Manufacturer	Part Number
CPU	Intel® Core i7-4700EQ 2.40GHz	Intel	i7-4700EQ
PCH	Mobile Intel QM87 Express Chipset	Intel	QM87
Memory	Swissbit XR-DIMM 8 GB DDR3-1600	Swissbit	SGV08G72B1BB2SA-DCWRT
port3 SATAII	Innodisk 256G SATA SSD	Innodisk
port4 SATA II	Innodisk SATAIII 128GB mSATA	Innodisk	64GB-AP-USDC64GE429-BTM
PCI Express Mini Card	Innodisk PCIeDOM 1ME3	Innodisk	DEEDM-32GD09SW1DC-D26
LAN1	Intel(R) I210 Gigabit Network Connection	Intel	I210
LAN2	Intel(R) I217-LM Ethernet Connection	Intel	I217-LM
Test Software	Burnin test v6.0、AS SSD Benchmark Intel Extreme Tuning Utility 4.3.0.11
Chamber	KSON THS-b4t-150 Chipeng SMO-3	KSON Chipeng	THS-b4t-150 SMO-3

Thermal Measurement

7STARLAKE provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus 7STARLAKE conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, 7STARLAKE is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in SR700-ET-i7-4700EQ for one hour, from +50 to +85°C.

SR700 System – IO Performance

Point	-40°C	25°C	40°C	45°C	50°C	55°C	60°C	70°C	75°C
CPU T-J	0	81	87	94	99	100	100	100	100
CPU Die	-19.9	59.5	65.2	75.3	80.3	84.6	88.2	92.6	96.4
Heatsink	-34.2	44.5	51.3	59.2	64.3	70.0	74.6	82.4	86.3
Δ1=(TJ-Die)	19.9	21.5	21.8	18.7	18.7	15.4	11.8	7.4	3.6
Δ2=(Die-Sink)	14.3	15.0	13.9	16.1	16.0	14.6	13.6	10.2	10.1
CPU Frenquency (GHz)	2.79	2.79	2.79	2.79	2.59	2.49	2.19	1.50	1.00

Thermal Solution

7STARLAKE implements unique cooling solution with copper heat spreader, pure copper heat pipe and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source – processor and chipset and absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, SR700 can ensure high reliability and stability while working under wide range temperature from -40°C up to 70°C.