Description
This Dev Kit consists of the following Trenz Electronic Products: TEBF0818-02A, TE0813-02-4AE81-A, and KK0813-02
TEBF0818-02A – UltraITX+ Baseboard for Trenz Electronic TE081X UltraSOM+
The Trenz Electronic TEBF0818 carrier board is a baseboard for the AMD Zynq Ultrascale+ MPSoC modules TE0813, TE0817 and TE0818, which exposes the module’s B2B connector pins to accessible connectors and provides a whole range of on-board components to test and evaluate the Zynq UltraScale+™ SoMs and for developing purposes. The carrier board has a Mini-ITX form factor making it capable to be fitted into a PC enclosure. On the PC enclosure’s rear and front panel, MGT interfaces and connectors are accessible, for the front panel elements there are also Intel-PC compatible headers available.
- Mini-ITX form factor, PC enclosure compatible
- ATX-24 power supply connector
- Optional 12V standard power plug
- Headers
- Intel 10-pin HDA audio
- Intel 9-pin power/reset button, Power-/HD-LED
- PC-BEEPER
- On-board power-/reset-switches
- 2 x configuration 4-bit DIP switches
- 2 x optional 4-wire PWM fan connectors
- PCIe slot – one PCIe lane (16 lane connector)
- CAN FD transceiver (10 Pin IDC connector and 6-pin header)
- 4 x On-board configuration EEPROMs (1 x Microchip 24LC128-I/ST, 3 x Microchip 24AA025E48T-I/OT)
- Dual SFP+ connector (2×1 Cage)
- 1 x DisplayPort (single lane)
- 1 x SATA connector
- 2 x USB 3.0 A connector (Superspeed Host Port (Highspeed at USB 2.0))
- 1 x USB 3.0 on-board connector with two ports
- FMC HPC slot (FMC_VADJ max. VCCIO)
- FMC fan
- Gigabit Ethernet RGMII PHY with RJ45 MagJack
- All carrier board peripherals’ I²C interfaces muxed to MPSoC’s I²C interface
- Quad programmable PLL clock generator
- 2 x SMA coaxial connectors for clock signals
- MicroSD/MMC card socket (bootable)
- 64 GBit (8 GByte) on-board eMMC Flash
- 2 x System controller CPLDs Lattice MachXO2 1200 HC
- 1 x Samtec FireFly (4 GT lanes bidirectional)
- 1 x Samtec FireFly connector for reverse loopback
- 20-pin ARM JTAG connector (PS JTAG0)
- 3 x Pmod connector (GPIO’s and I²C interface to SC CPLDs and MPSoC module)
- On-board DC-DC PowerSoCs
- Size: 170 mm × 170 mm. Please download the assembly diagram for exact details.
- Mating height with standard connectors: 5 mm
TE0813-02-4AE81-A – MPSoC Module with AMD Zynq™ UltraScale+™ ZU4CG-1E, 4 GByte DDR4, 5.2 x 7.6 cm
The TE0813 is largely identical in construction to the TE0803. The essential difference are new Samtec BGA connectors, which guarantees a reliable contact. The dimensions are identical.
The Trenz Electronic TE0813-02-4AE81-A is an industrial-grade MPSoC module integrating a AMD Zynq™ UltraScale+™ with ZU4CG, 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O’s is provided via rugged high-speed stacking connections.
- SoC / FPGA
- Device: AMD Zynq™ UltraScale+™ XCZU4CG-1SFVC784E
- Speedgrade: -1
- Temperature range: Extended
- Package: SFVC784
- RAM / Storage
- 4 GByte DDR4 SDRAM
- 128 MByte QSPI Boot Flash
- 2 Kbit serial EEPROM with EUI-48 Node Identity
- On Board
- Oscillator
- Programmable 4-channel PLL clock generator
- Interface
- Plug-on module with 4 x 240 pin B2B connectors (ADM6)
- 204 PL IO
- HP: 156
- HD: 48
- 65 PS MIO
- 4 PS GTR
- 4 PL GTH
- I2C, JTAG
- Power
- 3.3V power supply required
- Dimension
- 5.2 x 7.6 cm
KK0813-02 – Heat Spreader for Trenz Electronic MPSoC-Module TE0813-02
