AV600X-CH

Military Mission GPU Computer, Data Recorder

  • MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions
  • Data Recorder up to 32TB storage with RAID 0/1/5
  • Intel® 9th Gen. Coffee Lake (H) Xeon® E-2276ML processor
  • Up to 128GB DDR4 SO-DIMM, non-ECC and ECC
  • NVIDIA RTX™ A1000, 2048 CUDA® cores, 4GB GDDR6 memory
  • NVMe 3.0 512GB.(MB/sec, Max.) 3,400/3,200 MB
  • MIL-STD-461 18V~36V DC-Input (Options for MIL-704/1275)
  • Extreme Temperature : -40°C to +60°C
  • Optional with External GPU Turbo Kit
  • Dimensions : 250(W) x 325 (L) x 100 (H) mm

Special Request :

  • Frame Grabber : 4xCH HD-SDI
  • Discrete IO : 4xDI 4xDO
  • Dual Redundant MIL-STD-1553 connections
  • Dual ARINC 429 input connections
  • Data Recorder: Up to 32TB SATA III SSD

 

 AV600X-CH Datasheet

 AV600 e-DM

 

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Description

AV600X-CH is driven by Intel® 9 Gen. Coffee Lake-H Xeon Processors. These processors are manufactured on Intel’s most up-to-date and optimized 14 nm technology, up to 6 CPU cores. It is high computing performance and flexibility for heavier IoT workloads. The H-series processors are ideally suited for space-constrained and purpose-built designs. Multiple offerings for scalable performance, enhanced performance over previous generation with up to 6 cores.

Designed for Harsh Environment
AV600X-CH highlights on its rugged design and high functionality, the system especially installed MIL-STD Amphenol type connectors and full IP66 protection allow system withstand in any kind of harsh environment. AV600X-CH supports extended temperature from -40°C to 55°C and MIL-STD-461 18V~36V DC-input Power supply which can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself.

Block Diagram

 

CE Verification

Specifications

System
CPU Intel® Xeon® E-2276ME, 45W Coffee Lake 9th Gen, 6C , Freq. 2.8 /4.5 GHz, 12MB cache

Intel® Xeon® E-2276ML, 25W Coffee Lake 9th Gen, 6C , Freq. 2.0 / 4.2 GHz, 12MB cache
Memory type 4 x 260 Pin DDR4 2400MHz SO-DIMM (up to 128GB, XEON®SKU support ECC)
CHIPSET CM246
GPU NVIDIA RTX™ A1000/A2000 embedded graphics

– Standard MXM 3.1 Type A (82 x 70 mm)

– 2048/2560 CUDA® cores, 16 RT Cores, and 64 Tensor Cores

– 6.66TFLOPS peak FP32 performance

– 4GB/8GB GDDR6 memory, 128-bit
On board Storage NVMe 3.0 512GB.(MB/sec, Max.) 3,400/3,200 MB
Expansion Slot 1 x M.2(M-key,Type: 2280 , SATA/PCIe 3.0 x 4 NVMe)

2 x Mini PCIe Full size (USB / PCIe and 1 x micro SIM Card)

1 x PCIe/104, 1 x FPE
TPM TPM 2.0 (SLB9665)
VIDEO INPUT 4 Channel capture module for 4 x SMA male connectors >(optional)

Storage
SATA 1x 2.5” SSD, Up to 4x SSD for Data recorder
M.2 1x 2280 M key (SATA only)

Front I/O
DC-in 1x DC-in , with D38999 connector
X1 1x DVI , with D38999 connector
X2 1x DVI , with D38999 connector
X3 2x GLAN + 3 x USB 2.0, with D38999 connector
X4 4x RS232/422/485 + 4 BIT DIO, with D38999 connector
LED 1x SSD/HDD LED indicator
switch 1x IP65 power button , with LED indicator

Power
Power input MIL-STD -461 18V~36V DC-Input

Application, Operating System
Application Military Platforms Requiring Compliance to MIL-STD-810 Where Harsh Temperature, Shock, Vibration, Altitude, Dust and MIL-461 EMI Conditions.
Operating System Windows® 10 64-bit / Linux (support by request)

Physical
Dimension 250(W) x 325 (L) x 100 (H)mm, (L=395mm for Data recorder, Options)
Weight 10.5 Kg
Chassis Aluminum Alloy
Heatsink Heatsink Aluminum Alloy, Corrosion Resistant

Environmental
Green Product RoHS, WEEE compliance
Operating Temp. -40°C to +60°C
Storage Temp. -40°C to +85°C
Relative Humidity 5% to 95%, non-condensing
MIL-STD-810 Method 507.5, Procedure II ( Temperature & Humidity )
Method 516.6 Shock-Procedure V Non-Operating ( Mechanical Shock )
Method 516.6 Shock-Procedure I Operating ( Mechanical Shock )
Method 514.6 Vibration Category 24/Non-Operating ( Category 20 & 24, Vibration )
Method 514.6 Vibration Category 20/Operating ( Category 20 & 24, Vibration )
Method 501.5, Procedure I ( Storage/High Temperature )
Method 501.5, Procedure II ( Operation/High Temperature )
Method 502.5, Procedure I ( Storage/Low Temperature )
Method 502.5, Procedure II ( Operation/Low Temperature )
Method 503.5, Procedure I ( Temperature shock )
Reliability No Moving Parts; Passive Cooling.
Designed & Manufactured using ISO 9001 / 2000 Certified Quality Program.
MIL-STD-461
CE102  :   10 KHz – 10 MHz
RE102-4 : 1.5 MHz -30 MHz – 5 GHz
RS103 :    200 MHz – 3.0 GHz – 5.0 GHz, 50 V/m equal for all frequencies
Designed to Meet Items ( Options )
CS101, CS114, CS115, CS116
CE106, RE103, RS101
MIL-STD-1275 Steady State 20V-33V
Surge Low 18V/500ms
Surge High 100V/500ms

Ordering Information

Thermal Solution

Video

Downloads

 

 AV600 MIL-810 514.6 Operation_2

 AV600 MIL-810 514.6 None-Operation_2

 7Starlake_AV600X-CH_QTP_20230131

 7Starlake_CE_EMI EMC Report

  7Starlake_CE_Safety Report

 

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